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1. (WO2018036162) CIRCUIT BONDING FORCE DETECTION BOARD FOR BURIED CIRCUIT PRODUCT, AND METHOD

Pub. No.:    WO/2018/036162    International Application No.:    PCT/CN2017/078927
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Sat Apr 01 01:59:59 CEST 2017
IPC: G01N 19/04
Applicants: GUANGZHOU FASTPRINT CIRCUIT TECH CO., LTD.
广州兴森快捷电路科技有限公司
SHENZHEN FASTPRINT CIRCUIT TECH CO.,LTD.
深圳市兴森快捷电路科技股份有限公司
TIANJIN FASTPRINT CIRCUIT TECH CO., LTD.
天津兴森快捷电路科技有限公司
Inventors: GUO, Hailei
郭海雷
LIN, Yi
林益
CUI, Zhengdan
崔正丹
Title: CIRCUIT BONDING FORCE DETECTION BOARD FOR BURIED CIRCUIT PRODUCT, AND METHOD
Abstract:
A circuit bonding force detection board for a buried circuit product, and a method.The circuit bonding force detection board for the buried circuit product is made by a buried circuit process, and comprises a detection circuit (10) and a PP medium layer (20). The detection circuit (10) comprises a connection circuit (110) and a plurality of fine circuits (120); one end of each fine circuit (120) is connected to the connection circuit (110); a bottom edge and side edge of the connection circuit (110) and a bottom edge and a side edge of the fine circuit (120) are all buried in the PP medium layer (20). According to the circuit bonding force detection board for the buried circuit product, and the method, the condition of a bottom edge bonding force and a side edge bonding force of the buried circuit product can be better reflected, and the obtained circuit bonding force and a peel strength can accurately reflect the circuit bonding force and the peel strength of any buried circuit product, which realizes the detection of the circuit bonding force for the buried circuit product, and is convenient and easy to operate.