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|1. (WO2018036161) LASER STRUCTURE FOR GRATING COUPLING AND PACKAGING METHOD|
|Applicants:||ACCELINK TECHNOLOGIES CO., LTD
|Title:||LASER STRUCTURE FOR GRATING COUPLING AND PACKAGING METHOD|
A laser element, comprising a substrate (1) and a laser chip (2). The laser chip is provided with an active region (21) for generating and outputting laser light and an electrode for supplying power to the laser chip. The substrate is provided with, at one end, an etching groove (14) at least partially accommodating the laser chip, and a light emitting surface (18) at the other end. The substrate is further provided with an optical waveguide (11) extending between the etching groove and the light emitting surface. The laser chip is arranged in the etching groove of the substrate, and the active region of the laser chip is aligned with the optical waveguide on the substrate. The laser element comprises only two parts, the substrate integrating the optical waveguide and the electrode as well as the laser chip, without any other discrete elements, and is simple in structural design and low in costs. The laser element can be made using a flip chip bonding alignment process to achieve the coupling of laser light paths and the coupling of the laser with a grating coupler of a silicon photonic integrated chip. The use of a passive alignment technology brings high coupling efficiency, and the laser element is suitable for efficient mass production.