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Pub. No.:    WO/2018/034914    International Application No.:    PCT/US2017/046180
Publication Date: 22.02.2018 International Filing Date: 10.08.2017
H01L 23/498 (2006.01), H01L 21/48 (2006.01), H01L 23/538 (2006.01), H05K 1/02 (2006.01)
Applicants: MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; One Microsoft Way Redmond, Washington 98052-6399 (US)
Inventors: HOLBERY, James David; (US).
MA, Siyuan; (US).
DICKEY, Michael David; (US).
FASSLER, Andrew L.; (US)
Agent: MINHAS, Sandip S.; (US).
CHEN, Wei-Chen Nicholas; (US).
DRAKOS, Katherine J.; (US).
HINOJOSA, Brianna L.; (US).
HOLMES, Danielle J.; (US).
SWAIN, Cassandra T.; (US).
WONG, Thomas S.; (US).
CHOI, Daniel; (US).
HWANG, William C.; (US).
WIGHT, Stephen A.; (US).
Priority Data:
15/239,645 17.08.2016 US
Abstract: front page image
(EN)One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.
(FR)Un exemple concerne une interconnexion électrique flexible comprenant un substrat, une voie conductrice de liquide supportée par le substrat, et une conductibilité anisotrope, un agent d'encapsulation à particules magnétiques intégré qui est en interface avec la voie conductrice de liquide pour se connecter à un autre élément de circuit.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)