WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2018034428) PROTECTIVE COVER, PROTECTIVE COVER PACKAGE COMPRISING SAME, AND ELECTRONIC DEVICE COMPRISING PROTECTIVE COVER
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/034428    International Application No.:    PCT/KR2017/006966
Publication Date: 22.02.2018 International Filing Date: 30.06.2017
IPC:
B32B 7/12 (2006.01), B32B 3/02 (2006.01), B32B 27/36 (2006.01), B32B 27/08 (2006.01), B32B 27/32 (2006.01), H05K 5/03 (2006.01)
Applicants: SAMSUNG ELECTRONICS CO., LTD. [KR/KR]; 129, Samsung-ro, Yeongtong-gu Suwon-si Gyeonggi-do 16677 (KR)
Inventors: KIM, Young Gyun; (KR).
OH, Jee Young; (KR).
HWANG, Da Um; (KR)
Agent: BAE, KIM & LEE IP GROUP; 11th Floor, Shinduk Bldg., 343, Gangnam-daero Seocho-gu Seoul 06626 (KR)
Priority Data:
10-2016-0103776 16.08.2016 KR
Title (EN) PROTECTIVE COVER, PROTECTIVE COVER PACKAGE COMPRISING SAME, AND ELECTRONIC DEVICE COMPRISING PROTECTIVE COVER
(FR) COUVERCLE DE PROTECTION, EMBALLAGE DE COUVERCLE DE PROTECTION COMPRENANT CELUI-CI, ET DISPOSITIF ÉLECTRONIQUE COMPRENANT UN COUVERCLE DE PROTECTION
(KO) 보호 커버, 이를 포함하는 보호 커버 패키지 및 상기 보호 커버를 포함하는 전자 장치
Abstract: front page image
(EN)Disclosed in various examples included in the specification are a protective cover for an electronic device, a protective cover package comprising the same, and an electronic device to which the protective cover is applied, the protective cover comprising: a flat region and a curved region disposed at an edge of the flat region and having a curvature of a designated size; a first protective layer having a designated transparency; a second protective layer disposed at the lower part of the first protective layer, and having a thickness of a designated size at least that of the first protective layer; an adhesive layer for adhering the first protective layer and the second protective layer; and a sticking layer disposed at the lower part of the second protective layer, wherein the thickness of the first protective layer is thicker than that of the second protective layer. Various examples are possible.
(FR)Divers exemples de l'invention concernent un couvercle de protection destiné à un dispositif électronique, un emballage de couvercle de protection comprenant celui-ci ainsi qu'un dispositif électronique auquel est appliqué le couvercle de protection, ledit couvercle de protection comprenant : une zone plate et une zone incurvée disposée sur un bord de la zone plate et présentant une courbure d'une taille désignée; une première couche de protection ayant une transparence désignée; une seconde couche de protection disposée dans la partie inférieure de la première couche de protection et ayant une épaisseur d'une taille désignée au moins égale à celle de la première couche de protection; une couche adhésive permettant de coller la première couche de protection et la seconde couche de protection; et une couche collante disposée dans la partie inférieure de la seconde couche de protection, l'épaisseur de la première couche de protection étant plus importante que celle de la seconde couche de protection. Divers exemples sont possibles.
(KO)명세서에 기재된 다양한 실시예들은, 평평한 영역과 상기 평평한 영역의 가장자리에 배치되며 지정된 크기의 곡률을 가지는 곡면 영역을 포함하고, 지정된 투명도를 가지는 제1 보호층, 상기 제1 보호층 하부에 배치되며, 상기 제1 보호층보다 지정된 크기 이상의 두께를 가지는 제2 보호층, 상기 제1 보호층과 상기 제2 보호층을 접착하는 접착층, 상기 제2 보호층 하부에 배치되는 점착층을 포함하고, 상기 제1 보호층은 상기 제2 보호층보다 두꺼운 두께를 가지는 전자 장치의 보호 커버, 이를 포함하는 보호 커버 패키지 및 상기 보호 커버가 적용된 전자 장치를 개시한다. 다양한 실시 예가 가능하다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)