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1. (WO2018033975) PLATE-SHAPED SOLDER MANUFACTURING METHOD AND MANUFACTURING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2018/033975 International Application No.: PCT/JP2016/074018
Publication Date: 22.02.2018 International Filing Date: 17.08.2016
IPC:
B23K 35/40 (2006.01) ,B23K 35/14 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
40
Making wire or rods for soldering or welding
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02
characterised by mechanical features, e.g. shape
12
not specially designed for use as electrodes
14
for soldering
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
魚住 守治 UOZUMI, Shuji; JP
作谷 和彦 SAKUTANI, Kazuhiko; JP
Agent:
高田 守 TAKADA, Mamoru; JP
高橋 英樹 TAKAHASHI, Hideki; JP
Priority Data:
Title (EN) PLATE-SHAPED SOLDER MANUFACTURING METHOD AND MANUFACTURING DEVICE
(FR) PROCÉDÉ DE FABRICATION D'UNE BRASURE EN FORME DE PLAQUE ET DISPOSITIF DE FABRICATION
(JA) 板状はんだの製造方法および製造装置
Abstract:
(EN) A plate-shaped solder manufacturing method according to the present application is provided with: a grouping step of grouping a plurality of thread solders together; and a pressure bonding step of pressure bonding the grouped plurality of thread solders to one another to form plate-shaped solder. A plate-shaped solder manufacturing device according to the present application is provided with: a grouping unit for grouping a plurality of thread solders together; and a pressure bonding unit for pressure bonding the plurality of thread solders to one another in the grouping unit to form plate-shaped solder.
(FR) La présente invention concerne un procédé de fabrication d'une brasure en forme de plaque, comprenant : une étape de regroupement consistant à regrouper ensemble une pluralité de brasures en fil ; et une étape de liaison par pression consistant à lier par pression la pluralité regroupée de brasures en fil les unes aux autres afin de former une brasure en forme de plaque. La présente invention concerne en outre un dispositif de fabrication de brasure en forme de plaque, comprenant : une unité de regroupement destinée à regrouper ensemble une pluralité de brasure en fil ; et une unité de liaison par pression destinée à lier par pression la pluralité de brasure en fil les unes aux autres dans l'unité de regroupement afin former une brasure en forme de plaque.
(JA) 本願の発明に係る板状はんだの製造方法は、複数の糸はんだを集約する集約工程と、集約された該複数の糸はんだを互いに圧着させ、板状はんだを形成する圧着工程と、を備える。本願の発明に係る板状はんだの製造装置は、複数の糸はんだを集約する集約部と、該集約部において該複数の糸はんだを互いに圧着させ、板状はんだを形成するための圧着部と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)