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1. (WO2018033102) INPUT ASSEMBLY AND MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/033102 International Application No.: PCT/CN2017/097702
Publication Date: 22.02.2018 International Filing Date: 16.08.2017
IPC:
G06F 3/041 (2006.01) ,G06K 9/00 (2006.01)
Applicants: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.[CN/CN]; No.18 Haibin Road, Wusha, Chang'an Dongguan, Guangdong 523860, CN
Inventors: ZHANG, Wenzhen; CN
Agent: ESSEN PATENT & TRADEMARK AGENCY; Hailrun Complex Block A Room 1709-1711 No.6021 Shennan Blvd, Futian District Shenzhen, Guangdong 518040, CN
Priority Data:
201610678008.216.08.2016CN
201620891031.516.08.2016CN
Title (EN) INPUT ASSEMBLY AND MANUFACTURING METHOD
(FR) ENSEMBLE D'ENTRÉE ET PROCÉDÉ DE FABRICATION
Abstract: front page image
(EN) An input assembly includes a touch panel, a fingerprint identification chip, and a flexible circuit board. The fingerprint identification chip is attached to a lower surface of the touch panel. The flexible circuit board is attached to the fingerprint identification chip. The touch panel and the flexible circuit board are correspondingly disposed on two opposite sides of the fingerprint identification chip.
(FR) Un ensemble d'entrée comprend un panneau tactile, une puce d'identification d'empreinte digitale, et une carte de circuit imprimé souple. La puce d'identification d'empreinte digitale est fixée à une surface inférieure du panneau tactile. La carte de circuit imprimé souple est fixée à la puce d'identification d'empreinte digitale. Le panneau tactile et la carte de circuit imprimé souple sont disposés de manière correspondante sur deux côtés opposés de la puce d'identification d'empreinte digitale.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)