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1. (WO2018032010) SYSTEMS AND METHODS FOR TREATING A METAL SUBSTRATE THROUGH THIN FILM PRETREATMENT AND A SEALING COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/032010 International Application No.: PCT/US2017/046804
Publication Date: 15.02.2018 International Filing Date: 14.08.2017
IPC:
C23C 22/34 (2006.01) ,C23C 22/44 (2006.01) ,C23C 22/83 (2006.01)
Applicants: PRC-DESOTO INTERNATIONAL, INC.[US/US]; 12780 San Fernando Road Sylmar, California 91342, US
Inventors: SYLVESTER, Kevin T.; US
VOTRUBA-DRZAL, Peter L.; US
BROWN-TSENG, Elizabeth S.; US
MARTIN, Justin J.; US
WANG, Shuqi; CN
MORRIS, Eric L.; US
Agent: FRANKLIN, J. Caleb; US
MEYERS, Diane R.; US
TREBILCOCK, Christine W.; US
Priority Data:
62/374,18812.08.2016US
Title (EN) SYSTEMS AND METHODS FOR TREATING A METAL SUBSTRATE THROUGH THIN FILM PRETREATMENT AND A SEALING COMPOSITION
(FR) SYSTÈMES ET PROCÉDÉS DE TRAITEMENT D'UN SUBSTRAT MÉTALLIQUE PAR PRÉTRAITEMENT DE FILM MINCE ET COMPOSITION D'ÉTANCHÉITÉ
Abstract: front page image
(EN) Disclosed herein is a system for treating a substrate. The system includes a pretreatment composition for treating at a least a portion of the substrate, the pretreatment composition comprising a Group IVB metal cation; and a sealing composition for treating at least a portion of the substrate treated with the pretreatment composition, the sealing composition comprising a Group IA metal cation. Also disclosed are methods of treated a substrate with the system. Also disclosed are substrates treated with the system and method.
(FR) La présente invention concerne un système de traitement d’un substrat. Le système comprend une composition de prétraitement destinée à traiter au moins une partie du substrat, la composition de prétraitement comportant un cation métallique du groupe IVB ; et une composition d’étanchéité destinée à traiter au moins une partie du substrat traité au moyen de la composition de prétraitement, la composition d’étanchéité comportant un cation métallique du groupe IA. L'invention concerne également des procédés de traitement d'un substrat au moyen du système. L'invention concerne également des substrats traités au moyen du système et du procédé.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)