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1. (WO2018031969) THERMOPILE MESH

Pub. No.:    WO/2018/031969    International Application No.:    PCT/US2017/046654
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Sun Aug 13 01:59:59 CEST 2017
IPC: G01K 1/02
G01K 3/14
G01K 7/02
Applicants: QUALCOMM INCORPORATED
Inventors: MERRIKH, Ali, Akbar
MAHMOUDI, Farsheed
SAEIDI, Mehdi
FLEMING, Evan, Bentley
Title: THERMOPILE MESH
Abstract:
A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.