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1. (WO2018031896) METHODS OF REDUCING METAL RESIDUE IN EDGE BEAD REGION FROM METAL-CONTAINING RESISTS

Pub. No.:    WO/2018/031896    International Application No.:    PCT/US2017/046518
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Sat Aug 12 01:59:59 CEST 2017
IPC: G03F 7/42
C11D 7/50
C11D 7/26
C11D 7/32
Applicants: INPRIA CORPORATION
Inventors: WALLER, Mollie
CARDINEAU, Brian, J.
JIANG, Kai
TELECKY, Alan, J.
MEYERS, Stephen, T.
CLARK, Benjamin, L.
Title: METHODS OF REDUCING METAL RESIDUE IN EDGE BEAD REGION FROM METAL-CONTAINING RESISTS
Abstract:
Methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.