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1. (WO2018031457) WARPAGE BALANCING IN THIN PACKAGES

Pub. No.:    WO/2018/031457    International Application No.:    PCT/US2017/045711
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Tue Aug 08 01:59:59 CEST 2017
IPC: H01L 23/498
H01L 25/07
H01L 23/00
Applicants: INVENSAS CORPORATION
Inventors: HABA, Belgacem
LEE, Sangil
MITCHELL, Craig
GUEVARA, Gabriel, Z.
DELACRUZ, Javier, A.
Title: WARPAGE BALANCING IN THIN PACKAGES
Abstract:
Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.