Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018030757) LIGHT EMITTING MODULE, FLASH MODULE, AND TERMINAL INCLUDING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/030757 International Application No.: PCT/KR2017/008562
Publication Date: 15.02.2018 International Filing Date: 08.08.2017
IPC:
H04N 5/225 (2006.01) ,H04M 1/02 (2006.01) ,G03B 15/05 (2006.01) ,H01L 33/48 (2010.01) ,H01L 33/58 (2010.01) ,H01L 33/54 (2010.01) ,H01L 33/38 (2010.01) ,H01L 33/52 (2010.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
M
TELEPHONIC COMMUNICATION
1
Substation equipment, e.g. for use by subscribers
02
Constructional features of telephone sets
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
15
Special procedures for taking photographs; Apparatus therefor
02
Illuminating scene
03
Combinations of cameras with lighting apparatus; Flash units
05
Combinations of cameras with electronic flash apparatus; Electronic flash units
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
38
with a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
이태성 LEE, Tae Sung; KR
정장훈 JEONG, Jang Hoon; KR
진민지 JIN, Min Ji; KR
정영규 JEONG, Young Kyu; KR
Agent:
김기문 KIM, Ki Moon; KR
Priority Data:
10-2016-010128009.08.2016KR
10-2016-010369616.08.2016KR
Title (EN) LIGHT EMITTING MODULE, FLASH MODULE, AND TERMINAL INCLUDING SAME
(FR) MODULE ÉLECTROLUMINESCENT, MODULE FLASH ET TERMINAL LES COMPRENANT
(KO) 발광 모듈, 플래시 모듈 및 이를 포함하는 단말기
Abstract:
(EN) An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition wall arranged at one side of the plurality of light emitting chips, and a second partition wall arranged at the other side of the plurality of light emitting chips so as to face the first partition wall; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partition walls. The light emitting module according to the embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside.
(FR) Un mode de réalisation concerne un module électroluminescent, un module flash et un terminal les comprenant. Le module électroluminescent selon un mode de réalisation comprend : une couche semi-conductrice ; une couche de phosphore disposée sur une surface de la couche semi-conductrice ; une pluralité de puces électroluminescentes comprenant une pluralité d'électrodes disposées sur une surface faisant face à une surface de la couche semi-conductrice ; une première paroi de séparation disposée sur un côté de la pluralité de puces électroluminescentes, et une seconde paroi de séparation disposée au niveau de l'autre côté de la pluralité de puces électroluminescentes de manière à faire face à la première paroi de séparation ; et une partie de moulage opaque, qui englobe la pluralité de puces électroluminescentes de telle sorte que la surface supérieure de la couche de phosphore et les surfaces inférieures de la pluralité d'électrodes sont exposées à l'extérieur, et qui est disposée sur le côté interne des première et seconde parois de séparation. Le module électroluminescent, selon le mode de réalisation, comprend : une couche semi-conductrice ; une couche de phosphore disposée sur une surface de la couche semi-conductrice ; une pluralité de puces électroluminescentes comprenant une pluralité d'électrodes disposées sur une surface faisant face à une surface de la couche semi-conductrice ; et une partie de moulage opaque, qui englobe la pluralité de puces électroluminescentes de telle sorte que la surface supérieure de la couche de phosphore et les surfaces inférieures de la pluralité d'électrodes sont exposées à l'extérieur.
(KO) 실시예는 발광 모듈, 플래시 모듈 및 이를 포함하는 단말기이다. 실시예에 따른 발광 모듈은 반도체층, 상기 반도체층의 일면에 배치된 형광체층, 및 상기 반도체층의 일면과 마주보는 면에 배치된 복수의 전극을 포함하는 복수의 발광 칩; 상기 복수의 발광 칩의 일측에 배치된 제1 격벽, 상기 제1 격벽과 마주보도록 상기 상기 복수의 발광 칩의 타측에 배치된 제2 격벽; 및 상기 형광체층의 상면과 상기 복수의 전극의 저면이 외부로 노출되도록 상기 복수의 발광 칩을 에워싸며 상기 제1 격벽과 상기 제2 격벽 내측에 배치되는 불투명 몰딩부;를 포함할 수 있다. 실시예에 따른 발광 모듈은 반도체층, 상기 반도체층의 일면에 배치된 형광체층, 및 상기 반도체층의 일면과 마주보는 면에 배치된 복수의 전극을 포함하는 복수의 발광 칩; 및 상기 형광체층의 상면과 상기 복수의 전극의 저면이 외부로 노출되도록 상기 복수의 발광 칩을 에워싸는 불투명 몰딩부를 포함할 수 있다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)