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1. (WO2018030695) LED MODULE AND METHOD FOR PREPARING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/030695 International Application No.: PCT/KR2017/008269
Publication Date: 15.02.2018 International Filing Date: 01.08.2017
IPC:
H01L 27/15 (2006.01) ,H01L 33/00 (2010.01) ,H01L 33/36 (2010.01) ,H01L 25/075 (2006.01) ,H01L 33/62 (2010.01) ,H01L 21/677 (2006.01) ,H05B 33/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15
including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
Applicants: LUMENS CO.,LTD.[KR/KR]; 12, Wongomae-ro, Giheung-gu Yongin-si Gyeonggi-do 17086, KR
Inventors: YOO, Taekyoung; KR
KIM, Daewon; KR
KIM, Jinmo; KR
CHOI, Jinwon; KR
HER, Jimin; KR
SHIN, Younghwan; KR
HAN, Sol; KR
LEE, Kyujin; KR
Agent: RYU, Changyeol; KR
Priority Data:
10-2016-010223911.08.2016KR
10-2016-015704524.11.2016KR
10-2017-003039510.03.2017KR
10-2017-003290016.03.2017KR
10-2017-003295516.03.2017KR
Title (EN) LED MODULE AND METHOD FOR PREPARING SAME
(FR) MODULE DE DEL ET SON PROCÉDÉ DE PRÉPARATION
(KO) 엘이디 모듈 및 그 제조방법
Abstract:
(EN) A method for preparing an LED module is disclosed. The method for preparing an LED module comprises: a chip-on-carrier preparing step for preparing a chip on carrier comprising a chip holding portion, which has a horizontal adhesion side, and a plurality of LED chips having electrode pads adhered to the adhesion side of the chip holding portion; and a transfer printing step for conveying the plurality of LED chips from the chip holding portion to a substrate, which is in another location, in a fixed array. The transfer printing step comprises: a primary stepping step for regionally exposing transfer tape to a light, which is for reducing the adhesion of the transfer tape, and thus forming adhesion regions at a fixed interval on the transfer tape; and a chip-picking-up step for pressing the transfer tape to the LED chips on the chip holding portion and thus adhering the LED chips to the adhesion regions of the transfer tape, respectively, and also separating the electrode pads of the LED chips from the chip holding portion.
(FR) L'invention concerne un procédé de préparation de module de DEL. Le procédé de préparation d'un module de DEL comprend : une étape de préparation de puce sur support pour préparer une puce sur un support comprenant une portion de support de puce, qui a un côté d'adhérence horizontale, et une pluralité de puces de DEL ayant des plots d'électrode adhérant au côté d'adhérence de la portion de support de puce; et une étape d'impression de transfert pour transporter la pluralité de puces de DEL de la portion de support de puce à un substrat, qui est dans un autre emplacement, dans un réseau fixe. L'étape d'impression par transfert comprend : une étape de pas primaire pour exposer par régions une bande de transfert à une lumière, qui est destinée à réduire l'adhérence de la bande de transfert, et à former ainsi des régions d'adhérence à un intervalle fixe sur la bande de transfert; et une étape de capture de puce pour presser la bande de transfert sur les puces de DEL sur la portion de support de puce et coller ainsi les puces de DEL aux régions d'adhérence de la bande de transfert, respectivement, et séparer également les plots d'électrode des puces de DEL de la portion de support de puce.
(KO) 엘이디 모듈 제조방법이 개시된다. 이 엘이디 모듈 제조방법은, 수평의 접착면을 갖는 칩 유지부 및 상기 칩 유지부의 접착면에 전극패드들이 접착된 다수의 엘이디 칩들을 포함하는 칩온 캐리어를 제작하는 칩온 캐리어 제작 공정과, 상기 칩 유지부로부터 다른 위치에 있는 기판으로 상기 다수의 엘이디 칩들을 일정 배열로 옮기는 전사 프린팅 공정을 포함하며, 상기 전사 프린팅 공정은, 트랜스퍼 테이프의 접착력을 약화시키는 광에 상기 트랜스퍼 테이프를 영역적으로 노출시켜, 상기 트랜스퍼 테이프에 정해진 간격으로 접착 영역들을 형성하는 1차 노광 단계; 및 상기 트랜스퍼 테이프를 상기 칩 유지부 상의 상기 엘이디 칩들에 가압하여, 상기 트랜스퍼 테이프의 상기 접착 영역들 각각에 상기 엘이디 칩들 각각을 부착시키는 한편, 상기 엘이디 칩의 전극패드들을 상기 칩 유지부로부터 분리시키는, 칩 픽업 단계를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)