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Pub. No.:    WO/2018/030664    International Application No.:    PCT/KR2017/007796
Publication Date: 15.02.2018 International Filing Date: 19.07.2017
H05K 1/02 (2006.01), H05K 7/20 (2006.01), H05K 3/42 (2006.01), C09K 5/14 (2006.01)
Applicants: SAMSUNG ELECTRONICS CO., LTD. [KR/KR]; 129, Samsung-ro, Yeongtong-gu Suwon-si Gyeonggi-do 16677 (KR)
Inventors: KANG, Seok-hun; (KR).
KIM, In-beom; (KR).
KIM, Bo-ram; (KR).
KIM, Soo-hong; (KR)
Agent: KIM, Tae-hun; (KR).
JEONG, Hong-sik; (KR)
Priority Data:
10-2016-0100589 08.08.2016 KR
Abstract: front page image
(EN)A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.
(FR)L'invention porte sur un ensemble formant carte de circuit imprimé. Un ensemble formant carte de circuit imprimé comprend une carte de circuit imprimé ; un composant électronique monté sur la carte de circuit imprimé ; un élément de rayonnement thermique qui entre en contact avec le composant électronique et qui est configuré pour recevoir et conduire la chaleur générée par le composant électronique ; et au moins une partie de connexion connectant la carte de circuit imprimé et l'élément de rayonnement thermique l'un à l'autre et configurée pour transférer la chaleur transmise par l'élément de rayonnement thermique jusqu'à la carte de circuit imprimé.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)