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1. (WO2018030664) PRINTED CIRCUIT BOARD ASSEMBLY
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Pub. No.: WO/2018/030664 International Application No.: PCT/KR2017/007796
Publication Date: 15.02.2018 International Filing Date: 19.07.2017
IPC:
H05K 1/02 (2006.01) ,H05K 7/20 (2006.01) ,H05K 3/42 (2006.01) ,C09K 5/14 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08
Materials not undergoing a change of physical state when used
14
Solid materials, e.g. powdery or granular
Applicants:
SAMSUNG ELECTRONICS CO., LTD. [KR/KR]; 129, Samsung-ro, Yeongtong-gu Suwon-si Gyeonggi-do 16677, KR
Inventors:
KANG, Seok-hun; KR
KIM, In-beom; KR
KIM, Bo-ram; KR
KIM, Soo-hong; KR
Agent:
KIM, Tae-hun; KR
JEONG, Hong-sik; KR
Priority Data:
10-2016-010058908.08.2016KR
Title (EN) PRINTED CIRCUIT BOARD ASSEMBLY
(FR) ENSEMBLE FORMANT CARTE DE CIRCUIT IMPRIMÉ
Abstract:
(EN) A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.
(FR) L'invention porte sur un ensemble formant carte de circuit imprimé. Un ensemble formant carte de circuit imprimé comprend une carte de circuit imprimé ; un composant électronique monté sur la carte de circuit imprimé ; un élément de rayonnement thermique qui entre en contact avec le composant électronique et qui est configuré pour recevoir et conduire la chaleur générée par le composant électronique ; et au moins une partie de connexion connectant la carte de circuit imprimé et l'élément de rayonnement thermique l'un à l'autre et configurée pour transférer la chaleur transmise par l'élément de rayonnement thermique jusqu'à la carte de circuit imprimé.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)