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1. (WO2018030516) SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM

Pub. No.:    WO/2018/030516    International Application No.:    PCT/JP2017/029096
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Fri Aug 11 01:59:59 CEST 2017
IPC: H01L 21/304
Applicants: TOKYO ELECTRON LIMITED
東京エレクトロン株式会社
Inventors: YOSHIDA Yuki
吉田 祐希
KAWANO Hisashi
河野 央
AIBARA Meitoku
相原 明徳
KAGAWA Koji
香川 興司
Title: SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
Abstract:
A substrate processing device which performs processing to fill a recess portion of a pattern formed in a substrate (W) with a sublimable substance comprises: a substrate holding unit (30) which holds the substrate; a chamber (20) accommodating a processing liquid supply unit (40), the substrate holding unit, and a processing liquid supply unit , the processing liquid supply unit supplying at least one type of solvent-containing processing liquid containing a solvent capable of dissolving the sublimable substance to the substrate; a gas supply mechanism which supplies gas into the chamber; and an exhaust mechanism which evacuates the atmosphere in the chamber. The substrate processing device is provided with an airflow control unit (such as open/close valves (54a, 54b)) which, in a processing liquid supply period in which the processing liquid supply unit supplies the solvent-containing processing liquid to the substrate, controls at least one of the gas supply mechanism and the exhaust mechanism (such as an evacuation path (53)) to achieve an airflow change for increasing the flow rate or flow velocity of airflow in a space around the substrate.