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|1. (WO2018030516) SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM|
|Applicants:||TOKYO ELECTRON LIMITED
|Title:||SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM|
A substrate processing device which performs processing to fill a recess portion of a pattern formed in a substrate (W) with a sublimable substance comprises: a substrate holding unit (30) which holds the substrate; a chamber (20) accommodating a processing liquid supply unit (40), the substrate holding unit, and a processing liquid supply unit , the processing liquid supply unit supplying at least one type of solvent-containing processing liquid containing a solvent capable of dissolving the sublimable substance to the substrate; a gas supply mechanism which supplies gas into the chamber; and an exhaust mechanism which evacuates the atmosphere in the chamber. The substrate processing device is provided with an airflow control unit (such as open/close valves (54a, 54b)) which, in a processing liquid supply period in which the processing liquid supply unit supplies the solvent-containing processing liquid to the substrate, controls at least one of the gas supply mechanism and the exhaust mechanism (such as an evacuation path (53)) to achieve an airflow change for increasing the flow rate or flow velocity of airflow in a space around the substrate.