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1. (WO2018030486) PACKAGE FOR MOUNTING ELECTRICAL ELEMENT, ARRAY PACKAGE AND ELECTRICAL DEVICE

Pub. No.:    WO/2018/030486    International Application No.:    PCT/JP2017/028988
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Thu Aug 10 01:59:59 CEST 2017
IPC: H01L 23/13
H01L 23/12
H01L 23/36
H01S 5/022
Applicants: KYOCERA CORPORATION
京セラ株式会社
Inventors: YAMAMOTO, Sentarou
山元 泉太郎
FURUKUBO, Youji
古久保 洋二
OKAMOTO, Masanori
岡本 征憲
HIGASHI,Toshifumi
東 登志文
Title: PACKAGE FOR MOUNTING ELECTRICAL ELEMENT, ARRAY PACKAGE AND ELECTRICAL DEVICE
Abstract:
This package for mounting an electrical element is provided with: a planar substrate (10); and at least one mount (11) that projects from a front surface (10a) of the substrate (10) and has a mounting surface (11a) on which an electrical element is mounted. The substrate (10) and the mount (11) are integrally formed from a ceramic. This package for mounting an electrical element is provided with: a terminal (12a) for elements, which is provided on the mounting surface (11a) of the mount (11); a lateral conductor (13) which is provided on a lateral surface (11b) of the mount (11) and extends in the thickness direction of the mount (11); and a substrate-side via conductor (15a) which is provided within the substrate (10) and extends in the thickness direction of the substrate (10). The terminal (12a) for elements, the lateral conductor (13) and the substrate-side via conductor (15a) are connected to each other.