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1. (WO2018030434) ADHESIVE COMPOSITION, CURED OBJECT, ELECTRONIC COMPONENT, AND ASSEMBLY COMPONENT

Pub. No.:    WO/2018/030434    International Application No.:    PCT/JP2017/028836
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Wed Aug 09 01:59:59 CEST 2017
IPC: C09J 201/00
C09J 4/00
C09J 11/06
C09J 175/04
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: TAMAGAWA, Tomokazu
玉川 智一
KIDA, Takumi
木田 拓身
YUUKI, Akira
結城 彰
TAKAHASHI, Toru
高橋 徹
Title: ADHESIVE COMPOSITION, CURED OBJECT, ELECTRONIC COMPONENT, AND ASSEMBLY COMPONENT
Abstract:
A purpose of the present invention is to provide an adhesive composition which has excellent adhesiveness and which facilitates low-temperature reworking. Another purpose of the present invention is to provide a cured object obtained from the adhesive composition and an electronic component and an assembly component both including a cured object obtained from the adhesive composition. The adhesive composition of the present invention comprises a moisture-curable resin and a blowing agent.