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1. (WO2018030278) POWER AMPLIFIER MODULE, FRONT END CIRCUIT AND COMMUNICATION DEVICE

Pub. No.:    WO/2018/030278    International Application No.:    PCT/JP2017/028276
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Fri Aug 04 01:59:59 CEST 2017
IPC: H03F 3/195
H03F 3/24
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: TAKENAKA, Isao
竹中 功
Title: POWER AMPLIFIER MODULE, FRONT END CIRCUIT AND COMMUNICATION DEVICE
Abstract:
This PA module (1) is provided with: a multilayer substrate having a ground pattern layer (GND) that is connected to the ground of a power supply (70); amplifier transistors (10, 20) which are arranged on the multilayer substrate; a bypass capacitor (23) having one end connected to the collector of the amplifier transistor (20); a first wiring line (L14) which connects the emitter of the amplifier transistor (10) and the ground pattern layer (GND) to each other; a second wiring line (L24) which connects the emitter of the amplifier transistor (20) and the ground pattern layer (GND) to each other; a third wiring line (L25) which connects the other end of the bypass capacitor (23) and the ground pattern layer (GND) to each other; and a fourth wiring line (L61) which is formed between the amplifier transistor (10) and the ground pattern layer (GND) and between the bypass capacitor (23) and the ground pattern layer (GND), and which connects the first wiring line (L14) and the third wiring line (L25) to each other.