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1. (WO2018030165) SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/030165    International Application No.:    PCT/JP2017/027238
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Fri Jul 28 01:59:59 CEST 2017
IPC: H01L 23/12
B23K 20/12
C04B 37/02
H01L 23/13
H01L 23/36
H01L 25/07
H01L 25/18
Applicants: KABUSHIKI KAISHA TOSHIBA
株式会社 東芝
Inventors: IGUCHI, Tomohiro
井口 知洋
TOMIOKA, Taizo
冨岡 泰造
Title: SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
Abstract:
This semiconductor module includes a semiconductor element, a metal base, a substrate, and a metal layer. The metal base has a stirring unit. The substrate is positioned between the semiconductor element and the metal base. The metal layer is in contact with the stirring unit, and is positioned between the metal base and the substrate.