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Machine translation
1. (WO2018030152) CIRCUIT MODULE AND METHOD FOR MANUFACTURING CIRCUIT MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/030152    International Application No.:    PCT/JP2017/027015
Publication Date: 15.02.2018 International Filing Date: 26.07.2017
IPC:
H01L 25/04 (2014.01), G01J 1/02 (2006.01), H01L 21/56 (2006.01), H01L 23/00 (2006.01), H01L 25/18 (2006.01), H05K 1/18 (2006.01), H05K 3/28 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP)
Inventors: HORIBE, Takayuki; (JP).
AMACHI, Nobumitsu; (JP).
MASAOKA, Tsuyoshi; (JP).
KATO, Daisuke; (JP)
Agent: YOSHIKAWA, Shuichi; (JP).
SOBAJIMA, Masaaki; (JP)
Priority Data:
2016-155910 08.08.2016 JP
Title (EN) CIRCUIT MODULE AND METHOD FOR MANUFACTURING CIRCUIT MODULE
(FR) MODULE DE CIRCUIT ET PROCÉDÉ DE PRODUCTION DE MODULE DE CIRCUIT
(JA) 回路モジュールおよび回路モジュールの製造方法
Abstract: front page image
(EN)Provided is a circuit module, comprising a sensor (13) that is mounted on a substrate (11), a mounting component (12) that is mounted on the same surface on the substrate (11) as the surface on which the sensor (13) is mounted, and a sealing member (14) that covers the mounting component (12), wherein the sealing member (14) has an opening (141) at a position including the sensor (13) such that the sealing member (14) is not in contact with at least part of the sensor (13), and an inner wall surface (141a) of the opening (141) is exposed.
(FR)L'invention concerne un module de circuit, comprenant un capteur (13) qui est monté sur un substrat (11), un composant de montage (12) qui est monté sur la même surface sur le substrat (11) en tant que surface sur laquelle est monté le capteur (13), et un élément d'étanchéité (14) qui recouvre le composant de montage (12), l'élément d'étanchéité (14) ayant une ouverture (141) à une position comprenant le capteur (13) de telle sorte que l'élément d'étanchéité (14) n'est pas en contact avec au moins une partie du capteur (13), et une surface de paroi interne (141a) de l'ouverture (141) est exposée.
(JA)基板(11)上に搭載されたセンサ(13)と、基板(11)上のセンサ(13)が搭載された面と同一の面に搭載された実装部品(12)と、実装部品(12)を覆う封止部材(14)とを備え、封止部材(14)は、センサ(13)の少なくとも一部と接触しないようにセンサ(13)を含む位置に開口部(141)を有し、開口部(141)の内壁面(141a)は露出している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)