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1. (WO2018030147) LINEAR IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/030147    International Application No.:    PCT/JP2017/026892
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Wed Jul 26 01:59:59 CEST 2017
IPC: H01L 27/146
H01L 23/28
H04N 1/028
Applicants: HAMAMATSU PHOTONICS K.K.
浜松ホトニクス株式会社
Inventors: MURAMATSU Norihiro
村松 紀宏
NOZAWA Katsunori
野澤 克徳
Title: LINEAR IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME
Abstract:
This linear image sensor is provided with: first and second sensor chips 11A, 12A; first and second substrates 21, 22; a common supporting substrate 30; a supporting part 60; a dam part 70; and a sealing part 80. The first sensor chip 11A is mounted on one end portion of the first substrate 21 so as to partially protrude therefrom. The second sensor chip 12A is mounted on one end portion of the second substrate 22 so as to partially protrude therefrom. The first and second substrates 21, 22 are mounted on the common supporting substrate 30. The supporting part 60 is provided in the space between end faces of the first and second substrates 21, 22. The dam part 70 is in an annular shape and is arranged so as to surround the sensor chips 11A, 12A. The sealing part 80 seals the sensor chips 11A, 12A in the region surrounded by the dam part 70. Consequently, the present invention enables the achievement of a configuration wherein arrangement of sensor chips with high accuracy and planarity in the surface of the sealing part are easily ensured.