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1. (WO2018030139) IMAGING ELEMENT PACKAGE AND CAMERA MODULE
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Pub. No.: WO/2018/030139 International Application No.: PCT/JP2017/026767
Publication Date: 15.02.2018 International Filing Date: 25.07.2017
IPC:
H01L 27/146 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
籾内 雄太 MOMIUCHI Yuta; JP
高岡 裕二 TAKAOKA Yuji; JP
中山 浩和 NAKAYAMA Hirokazu; JP
田仲 清久 TANAKA Kiyohisa; JP
戸川 実栄 TOGAWA Miyoshi; JP
関 大一 SEKI Hirokazu; JP
岸田 栄一郎 KISHIDA Eiichirou; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2016-15557008.08.2016JP
Title (EN) IMAGING ELEMENT PACKAGE AND CAMERA MODULE
(FR) BOITIER D'ÉLÉMENTS D'IMAGERIE ET MODULE DE CAMÉRA
(JA) 撮像素子パッケージおよびカメラモジュール
Abstract:
(EN) The present technique relates to: an imaging element package which is able to have improved reliability; and a camera module. An imaging element package according to the present invention is provided with: a flexible substrate; an imaging element which is connected to a first surface of the flexible substrate; and a member which has a linear expansion coefficient different from that of the flexible substrate, and which is bonded to a second surface of the flexible substrate by means of an adhesive, said second surface being on the reverse side of the first surface. A portion of the adhesive is provided with a slit that intersects with the direction from the imaging element toward an end of the flexible substrate when viewed from the direction perpendicular to the flexible substrate. The present technique is applicable to a camera module.
(FR) La présente technique concerne : un boîtier d'élément d'imagerie qui est apte à avoir une fiabilité améliorée; et un module de caméra. Un boîtier d'élément d'imagerie selon la présente invention comporte : un substrat flexible; un élément d'imagerie qui est relié à une première surface du substrat flexible; et un élément qui a un coefficient de dilatation linéaire différent de celui du substrat flexible, et qui est collé à une seconde surface du substrat flexible au moyen d'un adhésif, ladite seconde surface se trouvant sur le côté opposé de la première surface. Une portion de l'adhésif est pourvue d'une fente qui croise la direction de l'élément d'imagerie vers une extrémité du substrat flexible lorsqu'elle est vue depuis la direction perpendiculaire au substrat flexible. La présente technique est applicable à un module de caméra.
(JA) 本技術は、信頼性を向上させることができるようにする撮像素子パッケージおよびカメラモジュールに関する。 撮像素子パッケージは、フレキシブル基板と、フレキシブル基板の第1の面に接続された撮像素子と、フレキシブル基板における第1の面とは反対側の第2の面に接着剤により接着された、フレキシブル基板とは線膨張係数が異なる部材とを備え、接着剤の部分には、フレキシブル基板と垂直な方向から見たときに、撮像素子からフレキシブル基板の端へと向かう方向と交差するスリットが形成されている。本技術はカメラモジュールに適用することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)