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1. (WO2018030112) ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SHEET, CURED OBJECT, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
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Pub. No.: WO/2018/030112 International Application No.: PCT/JP2017/026417
Publication Date: 15.02.2018 International Filing Date: 21.07.2017
IPC:
C08F 290/06 (2006.01) ,H01L 21/56 (2006.01) ,H01L 21/60 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290
Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02
on to polymers modified by introduction of unsaturated end groups
06
Polymers provided for in subclass C08G52
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.[JP/JP]; 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors: YAMATSU Shigeru; --
WATANABE Kazuki; --
KANAGAWA Naoki; --
SASAKI Daisuke; --
Agent: KAMATA Kenji; JP
MAEDA Hiroo; JP
Priority Data:
2016-15783410.08.2016JP
Title (EN) ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SHEET, CURED OBJECT, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) COMPOSITION ACRYLIQUE D'ENCAPSULATION, MATÉRIAU EN FEUILLES, FEUILLE STRATIFIÉE, OBJET DURCI, DISPOSITIF SEMI-CONDUCTEUR ET PROCÉDÉ DE PRODUCTION DE CE DISPOSITIF
(JA) 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法
Abstract:
(EN) An acrylic composition for encapsulation which comprises an acrylic compound, a poly(phenylene ether) resin having a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.
(FR) L'invention concerne une composition acrylique d'encapsulation contenant un composé acrylique, une résine de polyphénylène éther pourvue d'un substituant polymérisable par voie radicalaire à un terminal, une charge inorganique et un initiateur de polymérisation radicalaire thermique.
(JA) 封止用アクリル組成物は、アクリル化合物と、ラジカル重合性を有する置換基を末端に有するポリフェニレンエーテル樹脂と、無機充填材と、熱ラジカル重合開始剤と、を含有する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)