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1. (WO2018029983) BONDING DEVICE
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Pub. No.:    WO/2018/029983    International Application No.:    PCT/JP2017/022285
Publication Date: 15.02.2018 International Filing Date: 16.06.2017
H01L 21/52 (2006.01)
Applicants: OSAKA UNIVERSITY [JP/JP]; 1-1, Yamadaoka, Suita-shi, Osaka 5650871 (JP)
Inventors: SUGANUMA Katsuaki; (JP).
NAGAO Shijo; (JP).
SEKI Shinya; (JP)
Agent: MAEI Hiroyuki; (JP)
Priority Data:
2016-158565 12.08.2016 JP
(JA) 接合装置
Abstract: front page image
(EN)A bonding device (100) bonds a component (C) to a substrate (B) using a metal material (M). The bonding device (100) is provided with a wall section (20), at least one pressing section (40), and a rotating shaft (30). The rotating shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42), and a pressing element (43) or a substrate supporting member (90). The arm (42) extends from the rotating shaft (30). The arm (42) rotates about the rotating shaft (30). The pressing element (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) by means of a point contact of the pressing element (43) with the component (C) or a point contact of the substrate supporting member (90) with the reference surface (142).
(FR)La présente invention concerne un dispositif de liaison (100) qui lie un composant (C) à un substrat (B) au moyen d’un matériau métallique (M). Le dispositif de liaison (100) est pourvu d’une section de paroi (20), d’au moins une section de pression (40) et d’un arbre rotatif (30). L’arbre rotatif (30) est fixé à la section de paroi (20). Chaque section de pression (40) comporte un bras (42), et un élément de pression (43) ou un élément de support de substrat (90). Le bras (42) s’étend depuis l’arbre rotatif (30). Le bras (42) tourne autour de l'arbre rotatif (30). L'élément de pression (43) presse le composant (C). L'élément de support de substrat (90) est disposé sur une surface de référence (142). L'élément de support de substrat (90) supporte le substrat (B). Le composant (C) est lié au substrat (B) au moyen d’un contact ponctuel de l’élément de pression (43) avec le composant (C) ou d'un contact ponctuel de l’élément de support de substrat (90) avec la surface de référence (142).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)