Search International and National Patent Collections

1. (WO2018029909) HEAT DISSIPATING STRUCTURE

Pub. No.:    WO/2018/029909    International Application No.:    PCT/JP2017/015569
Publication Date: Fri Feb 16 00:59:59 CET 2018 International Filing Date: Wed Apr 19 01:59:59 CEST 2017
IPC: H05K 7/20
H01L 23/36
H01L 23/40
Applicants: KYB CORPORATION
KYB株式会社
Inventors: TOMITA, Haruki
富田 陽紀
EGUCHI, Yuu
江口 悠
Title: HEAT DISSIPATING STRUCTURE
Abstract:
Provided is a heat dissipating structure enabling to sufficiently improve dissipation efficiency of heat generated in an electronic component. An electronic apparatus (1) has a heat dissipating structure for dissipating heat generated in an electronic component (10) that is mounted on one surface of an electronic substrate (20). The electronic apparatus (1) is provided with a heat sink (30), a heat dissipating grease (50), and an external force applying unit (70). The heat sink (30) is provided on the one surface side of the electronic substrate (20) by having a gap between the electronic component (10) and the heat sink. The heat dissipating grease (50) is provided between the electronic component (10) and the heat sink (30). The external force applying unit (70) applies, to the electronic substrate (20) and/or the heat sink (30), an external force in the direction in which the gap between the electronic substrate (20) and the heat sink (30) is reduced.