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1. (WO2018026950) MODULAR SEISMIC ISOLATION SUPPORTS AND FLOORS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/026950 International Application No.: PCT/US2017/045151
Publication Date: 08.02.2018 International Filing Date: 02.08.2017
IPC:
F24F 7/10 (2006.01) ,E04F 15/024 (2006.01) ,E04B 1/98 (2006.01) ,H05K 5/04 (2006.01) ,H05K 13/00 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
24
HEATING; RANGES; VENTILATING
F
AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
7
Ventilation
04
with ducting systems
06
with forced air circulation, e.g. by fan
10
with air supply, or exhaust, through perforated wall, floor or ceiling
E FIXED CONSTRUCTIONS
04
BUILDING
F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
15
Flooring
02
Flooring or floor layers composed of a number of similar elements
024
Sectional false floors, e.g. computer floors
E FIXED CONSTRUCTIONS
04
BUILDING
B
GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
1
Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
62
Insulation or other protection; Elements or use of specified material therefor
92
Protection against other undesired influences or dangers
98
against vibrations or shocks; against mechanical destruction, e.g. by air-raids
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
04
Metal casings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Applicants: HUBBARD, Donald, A.[US/US]; US
MORENO, Gil, A.[US/US]; US
WORKSAFE TECHNOLOGIES[US/US]; 25133 Avenue Tibbitts, Bldg. F Valencia, CA 91355, US (AllExceptUS)
Inventors: HUBBARD, Donald, A.; US
MORENO, Gil, A.; US
Agent: FISHER, Carlos, A.; US
Priority Data:
62/370,19202.08.2016US
Title (EN) MODULAR SEISMIC ISOLATION SUPPORTS AND FLOORS
(FR) SUPPORTS ET PLANCHERS MODULAIRES À ISOLATION SISMIQUE
Abstract:
(EN) Improved support systems, including seismic isolation platforms, tracks and flooring systems are disclosed for protecting a payload, for example, data center racks containing delicate computer equipment such as a hard disk drive, from damage due to vibrations such as seismic vibrations and the like. The systems are modular in design, and can be assembled and changed quickly, while being strong and robust enough to support heavy loads.
(FR) La présente invention concerne des systèmes de support améliorés, y compris des plateformes, des rails et des systèmes de revêtement de sols à isolation sismique, destinés à protéger une charge utile, par exemple des bâtis de centres informatiques comportant des matériels informatiques délicats tels qu'un lecteur de disque dur, contre les dommages attribuables aux vibrations telles que les vibrations sismiques et autres. Les systèmes sont de conception modulaire, et peuvent être assemblés et modifiés rapidement, tout en étant suffisamment résistants et robustes pour supporter des charges lourdes.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)