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1. (WO2018026251) METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFER
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Pub. No.: WO/2018/026251 International Application No.: PCT/KR2017/008515
Publication Date: 08.02.2018 International Filing Date: 07.08.2017
IPC:
H01L 21/02 (2006.01) ,H01L 21/324 (2006.01) ,H01L 33/00 (2010.01) ,H01L 21/67 (2006.01)
[IPC code unknown for H01L 21/02][IPC code unknown for H01L 21/324][IPC code unknown for H01L 33][IPC code unknown for H01L 21/67]
Applicants:
무진전자 주식회사 MUJIN ELECTRONICS CO., LTD. [KR/KR]; 서울시 영등포구 은행로 3 10층 10F 3, Eunhaeng-ro Yeongdeungpo-gu Seoul 07237, KR
Inventors:
이길광 LEE, Gil Gwang; KR
윤용혁 YOON, Yong Hyeock; KR
Agent:
안상정 AN, Sang Jeong; KR
Priority Data:
10-2016-009995805.08.2016KR
Title (EN) METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFER
(FR) PROCÉDÉ ET APPAREIL DE NETTOYAGE D'UNE TRANCHE DE SEMI-CONDUCTEUR
(KO) 반도체 웨이퍼 세정 방법 및 장치
Abstract:
(EN) The present disclosure relates to a method for cleaning a semiconductor wafer, comprising the steps of: preparing a wafer; dry-cleaning the wafer; and wet-cleaning the wafer, wherein the wafer is heated during the step of wet-cleaning the wafer.
(FR) La présente invention concerne un procédé de nettoyage d'une tranche de semi-conducteur, comprenant les étapes consistant à : préparer une tranche ; nettoyer à sec la tranche ; et nettoyer par voie humide la tranche, la tranche étant chauffée pendant l'étape de nettoyage par voie humide de la tranche.
(KO) 본 개시는 반도체 웨이퍼 세정 방법에 있어서, 웨이퍼를 준비하는 단계; 웨이퍼를 건식 세정 하는 단계;그리고, 웨이퍼를 습식 세정 하는 단계;를 포함하며, 웨이퍼를 습식 세정 하는 단계;에서, 웨이퍼를 가열하는 것을 특징으로 하는 반도체 웨이퍼 세정방법에 관한 것이다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)