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1. (WO2018026035) SEMICONDUCTOR PACKAGING STRUCTURE COMPRISING METAL PLATE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/026035    International Application No.:    PCT/KR2016/008631
Publication Date: Fri Feb 09 00:59:59 CET 2018 International Filing Date: Sat Aug 06 01:59:59 CEST 2016
IPC: H01L 23/00
H01L 23/522
Applicants: PICOPACK CO., LTD.
(주)피코팩
Inventors: OH, Guenyoung
오근영
YU, Joohye
유주혜
Title: SEMICONDUCTOR PACKAGING STRUCTURE COMPRISING METAL PLATE AND MANUFACTURING METHOD THEREFOR
Abstract:
The present invention relates to a semiconductor packaging comprising a metal plate, the semiconductor packaging structure comprising: a metal plate having a groove for removal of an electronic element; an electronic element; and a silicon-based adhesive for allowing the electronic element to adhere to the metal plate, wherein the silicone-based adhesive satisfies all of formulas 1 to 3 below: [Formula 1] 1,200 ≤ viscosity (cP) ≤ 1,800; [Formula 2] volatile condensable mass ≤ 0.01 wt%; and [Formula 3] total mass loss ≤ 0.05 wt% (Formula 1 represents a value measured before curing and Formulas 2 and 3 represent values measured after curing; and Formula 1 is measured according to the ASTM D1084 test method and Formulas 2 and 3 are measured according to the ASTM E595 test method).