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1. (WO2018026035) SEMICONDUCTOR PACKAGING STRUCTURE COMPRISING METAL PLATE AND MANUFACTURING METHOD THEREFOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/026035    International Application No.:    PCT/KR2016/008631
Publication Date: 08.02.2018 International Filing Date: 05.08.2016
IPC:
H01L 23/00 (2006.01), H01L 23/522 (2006.01)
Applicants: PICOPACK CO., LTD. [KR/KR]; 206 96, Gajeongbuk-ro Yuseong-gu Daejeon 34111 (KR)
Inventors: OH, Guenyoung; (KR).
YU, Joohye; (KR)
Agent: AHN, Jaeyul; (KR)
Priority Data:
10-2016-0099409 04.08.2016 KR
10-2016-0099414 04.08.2016 KR
Title (EN) SEMICONDUCTOR PACKAGING STRUCTURE COMPRISING METAL PLATE AND MANUFACTURING METHOD THEREFOR
(FR) STRUCTURE D'EMBALLAGE DE SEMI-CONDUCTEUR COMPRENANT UNE PLAQUE MÉTALLIQUE ET SON PROCÉDÉ DE FABRICATION
(KO) 금속 판을 포함하는 반도체 패키징 구조 및 이의 제조방법
Abstract: front page image
(EN)The present invention relates to a semiconductor packaging comprising a metal plate, the semiconductor packaging structure comprising: a metal plate having a groove for removal of an electronic element; an electronic element; and a silicon-based adhesive for allowing the electronic element to adhere to the metal plate, wherein the silicone-based adhesive satisfies all of formulas 1 to 3 below: [Formula 1] 1,200 ≤ viscosity (cP) ≤ 1,800; [Formula 2] volatile condensable mass ≤ 0.01 wt%; and [Formula 3] total mass loss ≤ 0.05 wt% (Formula 1 represents a value measured before curing and Formulas 2 and 3 represent values measured after curing; and Formula 1 is measured according to the ASTM D1084 test method and Formulas 2 and 3 are measured according to the ASTM E595 test method).
(FR)La présente invention concerne un emballage de semi-conducteur comprenant une plaque métallique, la structure de boîtier de semi-conducteur comprenant : une plaque métallique ayant une rainure pour le retrait d'un élément électronique; un élément électronique; et un adhésif à base de silicium pour permettre à l'élément électronique d'adhérer à la plaque métallique, l'adhésif à base de silicone satisfaisant toutes les formules 1 à 3 ci-dessous : [formule 1] 1,200 ≤ viscosité (cP) ≤ 1,800; [formule 2] masse condensable volatile ≤ 0,01 % en poids; et [formule 3] la perte de masse totale ≤ 0,05 % en poids (formule 1 représente une valeur mesurée avant le durcissement et les formules 2 et 3 représentent des valeurs mesurées après durcissement; et la formule 1 est mesurée selon le procédé de test ASTM D1084 et les formules 2 et 3 sont mesurées selon le procédé de test ASTM E595).
(KO)본 발명은 전자 소자 제거용 홈이 구비된 금속 판; 전자 소자; 및 상기 전자 소자를 상기 금속 판에 접착시키는 실리콘계 접착제;를 포함하며, 상기 실리콘계 접착제는 하기 식 1 내지 3을 모두 만족하는 것인 금속 판을 포함하는 반도체 패키징에 관한 것이다. [식 1] 1,200 ≤ 점도(cP) ≤ 1,800 [식 2] 휘발성 응축 질량 ≤ 0.01 중량% [식 3] 총 질량 손실 ≤ 0.05 중량% (상기 식 1은 경화 전 측정된 값이고, 상기 식 2 및 3은 경화 후 측정된 값이며, 상기 식 1은 ASTM D1084, 상기 식 2와 3은 ASTM E595의 시험 방법으로 측정된 것이다.)
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)