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1. (WO2018026004) SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT

Pub. No.:    WO/2018/026004    International Application No.:    PCT/JP2017/028432
Publication Date: Fri Feb 09 00:59:59 CET 2018 International Filing Date: Sat Aug 05 01:59:59 CEST 2017
IPC: H01L 23/12
H05K 3/46
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
三菱瓦斯化学株式会社
Inventors: HIRANO, Syunsuke
平野 俊介
KATO, Yoshihiro
加藤 禎啓
OGASHIWA, Takaaki
小柏 尊明
KAWASHITA, Kazuaki
川下 和晃
NAKAJIMA, Youichi
中島 洋一
Title: SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
Abstract:
A method for manufacturing a package substrate for mounting a semiconductor element, including: a first laminate readying step for readying a first laminate having a resin layer, an adhesive layer provided on at least the side of one surface of the resin layer and provided with a peeling means, and a first metal layer provided on the adhesive layer; a first wiring formation step for etching the first metal layer and forming a first wiring conductor on the first laminate; a second laminate formation step for laminating an insulating resin layer and a second metal layer in the sequence listed on the surface of the first laminate on which the first wiring conductor is provided, and forming a second laminate; a second wiring formation step for forming, in the insulating resin layer, a non-penetrating hole reaching the first wiring conductor, performing electroplating and/or electroless plating on the insulating resin layer in which the non-penetrating hole is formed, and forming a second wiring conductor on the insulating resin layer; and a peeling step for peeling at least the resin layer from the second laminate on which the second wiring conductor is formed.