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1. (WO2018025781) ELECTRODE PLATE
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Pub. No.: WO/2018/025781 International Application No.: PCT/JP2017/027560
Publication Date: 08.02.2018 International Filing Date: 28.07.2017
IPC:
H01L 21/3065 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306
Chemical or electrical treatment, e.g. electrolytic etching
3065
Plasma etching; Reactive-ion etching
Applicants:
日本新工芯技株式会社 THINKON NEW TECHNOLOGY JAPAN CORPORATION [JP/JP]; 東京都練馬区豊玉北四丁目30番10号 30-10, Toyotamakita 4-chome, Nerima-ku, Tokyo 1760012, JP
Inventors:
碇 敦 IKARI Atsushi; JP
藤井 智 FUJII Satoshi; JP
Agent:
吉田 正義 YOSHIDA Tadanori; JP
Priority Data:
2016-15398704.08.2016JP
Title (EN) ELECTRODE PLATE
(FR) PLAQUE D'ÉLECTRODE
(JA) 電極板
Abstract:
(EN) This invention is characterized in comprising a plurality of plate-shaped electrode members (32, 34) and a joining part for joining the electrode members (32, 34) together in the thickness direction, the joining part containing boron oxide, melting at 700°C or below, and having a heat resistance allowing the joining part to withstand a temperature of at least 150°C.
(FR) Cette invention est caractérisée en ce qu'elle comprend une pluralité d'éléments d'électrode en forme de plaque (32, 34) et une partie de jonction pour relier les éléments d'électrode (32, 34) dans le sens de l'épaisseur, la partie de jonction contenant de l'oxyde de bore, fondant à 700 °C ou moins, et ayant une résistance à la chaleur permettant à la partie de jonction de résister à une température d'au moins 150° C.
(JA) 複数の板状電極部材(32,34)と、前記電極部材(32,34)同士を厚さ方向に接合する接合部とを備え、前記接合部は、少なくとも150℃に耐える耐熱性を有し、700℃以下で融解し、酸化ホウ素を含有することを特徴とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)