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1. (WO2018025655) LIQUID CONCENTRATE OF COMPOSITION FOR ROUGH-POLISHING SILICON WAFERS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/025655 International Application No.: PCT/JP2017/026405
Publication Date: 08.02.2018 International Filing Date: 21.07.2017
IPC:
H01L 21/304 (2006.01) ,B24B 37/00 (2012.01) ,C09K 3/14 (2006.01)
Applicants: FUJIMI INCORPORATED[JP/JP]; 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502, JP
Inventors: MURASE, Takehiko; JP
TANIGUCHI, Megumi; JP
NUMATA, Keisuke; JP
AKIZUKI, Reiko; JP
TSUCHIYA, Kohsuke; JP
Agent: ABE, Makoto; JP
Priority Data:
2016-15232402.08.2016JP
Title (EN) LIQUID CONCENTRATE OF COMPOSITION FOR ROUGH-POLISHING SILICON WAFERS
(FR) CONCENTRÉ DE COMPOSITION POUR MEULAGE DE DÉGROSSISSAGE DE TRANCHE DE SILICIUM
(JA) シリコンウェーハ粗研磨用組成物の濃縮液
Abstract:
(EN) Provided is a liquid concentrate of a composition for rough-polishing silicon wafers, which, when being diluted, is able to deliver preferable polishing performance, and which exhibits excellent stability. The liquid concentrate of a composition for rough-polishing silicon wafers provided by the present invention comprises abrasive particles, a basic compound, and a water-soluble polymer, wherein the ratio [rg/d] of the radius of gyration rg [nm] of the water-soluble polymer to the inter-particle distance d [nm] of the abrasive particles is 4.7 or less.
(FR) L’invention fournit un concentré de composition pour meulage de dégrossissage de tranche de silicium qui permet de développer des performances de meulage satisfaisantes après dilution, et qui présente une excellente stabilité. Le concentré de composition pour meulage de dégrossissage de tranche de silicium de l’invention contient des grains abrasifs, un composé basique et un polymère hydrosoluble. Le rapport [rg/d] du rayon de giration rg[nm] dudit polymère hydrosoluble vis-à-vis de la distance interparticulaire d[nm] desdits grains abrasifs dans ledit concentré, est inférieur ou égal à 4,7.
(JA) 希釈後には良好な研磨性能を発揮することが可能であり、かつ安定性に優れたシリコンウェーハ粗研磨用組成物の濃縮液を提供する。本発明により提供されるシリコンウェーハ粗研磨用組成物の濃縮液は、砥粒、塩基性化合物および水溶性高分子を含む。前記濃縮液中における前記砥粒の粒子間距離d[nm]に対する前記水溶性高分子の慣性半径rg[nm]の比[rg/d]は4.7以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)