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|1. (WO2018025318) HEAT PUMP DEVICE|
|Applicants:||MITSUBISHI ELECTRIC CORPORATION
|Title:||HEAT PUMP DEVICE|
This heat pump device is provided with a first refrigerant circuit, second refrigerant circuit, heat storage circuit, and water circuit, the first refrigerant circuit has a configuration wherein a first heat exchanger, second heat exchanger, third heat exchanger, and fourth heat exchanger are connected, and the second refrigerant circuit has a configuration wherein a fifth heat exchanger and the second heat exchanger are connected. The water circuit has: a first water circuit, in which a pump, the first heat exchanger, and the fifth heat exchanger are connected; a second water circuit, which is branched from, between the pump and the first heat exchanger, the first water circuit, and connected to, between the first heat exchanger and the fifth heat exchanger, the first water circuit; and a third water circuit, which is branched from the first water circuit in the downstream of the fifth heat exchanger, and connected to the first water circuit in the upstream of the pump via the sixth heat exchanger.