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1. (WO2018025318) HEAT PUMP DEVICE

Pub. No.:    WO/2018/025318    International Application No.:    PCT/JP2016/072587
Publication Date: Fri Feb 09 00:59:59 CET 2018 International Filing Date: Wed Aug 03 01:59:59 CEST 2016
IPC: F24H 4/04
F24H 4/02
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: YANACHI, Satoru
梁池 悟
OBAYASHI, Tomoyoshi
大林 誠善
KADOWAKI, Kimitaka
門脇 仁隆
SAIKUSA, Tetsuji
七種 哲二
OTSUBO, Yusuke
大坪 祐介
Title: HEAT PUMP DEVICE
Abstract:
This heat pump device is provided with a first refrigerant circuit, second refrigerant circuit, heat storage circuit, and water circuit, the first refrigerant circuit has a configuration wherein a first heat exchanger, second heat exchanger, third heat exchanger, and fourth heat exchanger are connected, and the second refrigerant circuit has a configuration wherein a fifth heat exchanger and the second heat exchanger are connected. The water circuit has: a first water circuit, in which a pump, the first heat exchanger, and the fifth heat exchanger are connected; a second water circuit, which is branched from, between the pump and the first heat exchanger, the first water circuit, and connected to, between the first heat exchanger and the fifth heat exchanger, the first water circuit; and a third water circuit, which is branched from the first water circuit in the downstream of the fifth heat exchanger, and connected to the first water circuit in the upstream of the pump via the sixth heat exchanger.