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1. (WO2018023887) PHOTOGRAPHING MODULE, MOLDED CIRCUIT BOARD ASSEMBLY AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREOF AND MANUFACTURING METHODS
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Pub. No.: WO/2018/023887 International Application No.: PCT/CN2016/103248
Publication Date: 08.02.2018 International Filing Date: 25.10.2016
IPC:
H04N 5/225 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
Applicants: NINGBO SUNNY OPOTECH CO., LTD.[CN/CN]; 66-68 Shunyu Road, Yuyao Ningbo, Zhejiang 315400, CN
Inventors: WANG, Mingzhu; CN
CHEN, Zhenyu; CN
GUO, Nan; CN
TANAKA, Takehiko; JP
ZHAO, Bojie; CN
DENG, Zilong; CN
Agent: NINGBO RAYMOND IP AGENCY FIRM; Suite 1501, 555 Rili Middle Road Shounan Subdistrict, Yinzhou District Ningbo, Zhejiang 315100, CN
Priority Data:
201610622330.301.08.2016CN
201610626667.101.08.2016CN
201620826033.601.08.2016CN
201620826035.501.08.2016CN
Title (EN) PHOTOGRAPHING MODULE, MOLDED CIRCUIT BOARD ASSEMBLY AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREOF AND MANUFACTURING METHODS
(FR) MODULE DE PHOTOGRAPHIE, ENSEMBLE DE CARTE DE CIRCUIT IMPRIMÉ MOULÉ, ENSEMBLE PHOTOSENSIBLE MOULÉ CORRESPONDANT ET PROCÉDÉS DE FABRICATION
(ZH) 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
Abstract:
(EN) A photographing module (100, 100'), a molded circuit board assembly (10) and a molded photosensitive assembly (10') thereof and manufacturing methods. The molded circuit board assembly (10) comprises a circuit board (11) and a molded base (12). The molded base (12) is integrated with the circuit board by means of a molding process. The molded photosensitive assembly (10') comprises a circuit board (11'), a photosensitive element (13'), and a molded base (12'). The molded base (12') is integrated with the circuit board and the photosensitive element by means of the molding process. The molded base (12, 12') forms a light window (122, 122'). The position of the light window (122, 122') corresponds to that of the photosensitive element (13, 13'), and the cross section of the light window (122, 122') is constructed into a trapezoid or multi-step trapezoid that increases gradually from bottom to top, so as to facilitate demolding, prevent damage to the molded base and avoid stray light.
(FR) L'invention porte sur un module de photographie (100, 100'), sur un ensemble de carte de circuit imprimé (10), sur un ensemble photosensible moulé (10') correspondant et sur des procédés de fabrication. L'ensemble carte de circuit imprimé (10) comprend une carte de circuit imprimé (11) et une base moulée (12). La base moulée (12) est intégrée à la carte de circuit imprimé au moyen d'un procédé de moulage. L'ensemble photosensible moulé (10') comprend une carte de circuit (11'), un élément photosensible (13') et une base moulée (12'). La base moulée (12') est intégrée à la carte de circuit imprimé et à l'élément photosensible au moyen du procédé de moulage. La base moulée (12, 12') forme une fenêtre de lumière (122, 122'). La position de la fenêtre de lumière (122, 122') correspond à celle de l'élément photosensible (13, 13'), et la section transversale de la fenêtre de lumière (122, 122') est construite en un trapézoïde ou un trapézoïde à plusieurs étages qui augmente graduellement de bas en haut, de manière à faciliter le démoulage, à empêcher un endommagement de la base moulée et à éviter une lumière parasite.
(ZH) 摄像模组(100,100')及其模塑电路板组件(10)和模塑感光组件(10')和制造方法,该模塑电路板组件(10)包括电路板(11)和模塑基座(12),其中模塑基座(12)通过模塑工艺与电路板一体结合,该模塑感光组件(10')包括电路板(11'),感光元件(13')和模塑基座(12'),其中模塑基座(12')通过模塑工艺与电路板和感光元件一体结合。模塑基座(12,12')形成光窗(122,122'),光窗(122,122')与感光元件(13,13')位置对应,并且光窗(122,122')截面构造成呈由下至上渐大的梯形或多阶梯形,以方便脱模、防止对模塑基座的损伤和避免杂散光。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)