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Machine translation
1. (WO2018022730) SEAMLESS TRENCH FILL USING DEPOSITION/ETCH TECHNIQUES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/022730    International Application No.:    PCT/US2017/043907
Publication Date: 01.02.2018 International Filing Date: 26.07.2017
IPC:
H01L 21/768 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054 (US)
Inventors: ANTHIS, Jeffrey W.; (US).
THOMPSON, David; (US)
Agent: BLANKMAN, Jeffrey I.; (US)
Priority Data:
62/367,606 27.07.2016 US
15/658,846 25.07.2017 US
Title (EN) SEAMLESS TRENCH FILL USING DEPOSITION/ETCH TECHNIQUES
(FR) REMPLISSAGE DE TRANCHÉES SANS SOUDURE À L'AIDE DE TECHNIQUES DE DÉPÔT/GRAVURE
Abstract: front page image
(EN)Methods for filing a feature on a substrate surface comprising depositing a conformal nitride film on the substrate surface and at least one feature on the surface, oxidizing a portion of the nitride film to form an asymmetric oxide film on top of the nitride film and etching the oxide film from the nitride film to leave a v-shaped nitride film in the at least one feature.
(FR)La présente invention concerne des procédés permettant de déposer un élément sur une surface de substrat, consistant à déposer un film de nitrure conforme sur la surface de substrat et au moins un élément sur la surface, à oxyder une partie du film de nitrure en vue de former un film d'oxyde asymétrique sur la partie supérieure du film de nitrure et à graver le film d'oxyde à partir du film de nitrure en vue de laisser un film de nitrure en forme de V dans ledit élément.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)