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1. (WO2018022510) MONOLAYER FILM MEDIATED PRECISION MATERIAL ETCH

Pub. No.:    WO/2018/022510    International Application No.:    PCT/US2017/043533
Publication Date: Fri Feb 02 00:59:59 CET 2018 International Filing Date: Tue Jul 25 01:59:59 CEST 2017
IPC: H01L 21/306
H01L 21/02
Applicants: TOKYO ELECTRON LIMITED
TOKYO ELECTRON U.S. HOLDINGS, INC.
Inventors: RANJAN, Alok
VENTZEK, Peter
Title: MONOLAYER FILM MEDIATED PRECISION MATERIAL ETCH
Abstract:
A method of etching is described. The method includes treating at least a portion of a surface exposed on a substrate with an adsorption-promoting agent to alter a functionality of the exposed surface and cause subsequent adsorption of a carbon-containing precursor, and thereafter, adsorbing the organic precursor to the functionalized surface to form a carbon-containing film. Then, at least a portion of the surface of the carbon-containing film is exposed to an ion flux to remove the adsorbed carbon-containing film and at least a portion of the material of the underlying substrate.