WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2018022293) GEL-TYPE THERMAL INTERFACE MATERIAL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/022293    International Application No.:    PCT/US2017/041498
Publication Date: 01.02.2018 International Filing Date: 11.07.2017
IPC:
H01L 23/373 (2006.01)
Applicants: HONEYWELL INTERNATIONAL INC. [US/US]; Intellectual Property-Patent Services 115 Tabor Road, M/S 4D3 P. O. Box 377 Morris Plains, New Jersey 07950 (US)
Inventors: ZHANG, Liqiang; (US).
DUAN, Huifeng; (US).
ZHANG, Kai; (US).
LIU, YaQun; (US).
SHEN, Ling; (US).
WANG, Wei Jun; (US).
KANG, Haigang; (US)
Agent: SZUCH, Colleen D.; (US)
Priority Data:
62/366,704 26.07.2016 US
62/436,746 20.12.2016 US
15/642,082 05.07.2017 US
Title (EN) GEL-TYPE THERMAL INTERFACE MATERIAL
(FR) MATÉRIAU D'INTERFACE THERMIQUE DU TYPE GEL
Abstract: front page image
(EN)A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
(FR)La présente invention porte sur un matériau d'interface thermique qui est utile pour transférer de la chaleur à partir de dispositifs électroniques générant de la chaleur, tels que des puces d'ordinateur, à des structures de dissipation de chaleur, telles que des disperseurs thermiques et des dissipateurs thermiques. Le matériau d'interface thermique comprend au moins une huile de silicone, et au moins une charge thermoconductrice.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)