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1. (WO2018021912) METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/021912 International Application No.: PCT/NL2017/050504
Publication Date: 01.02.2018 International Filing Date: 25.07.2017
IPC:
H01L 23/00 (2006.01) ,B23K 1/00 (2006.01) ,B23K 1/005 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
[IPC code unknown for B23K 1/05]
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO [NL/NL]; Anna Van Buerenplein 1 2595 DA 's-Gravenhage, NL
Inventors:
ARUTINOV, Gari; NL
SMITS, Edsger Constant Pieter; NL
VAN DEN BRAND, Jeroen; NL
Agent:
JANSEN, C.M.; V.O. P.O. Box 87930 2508 DH Den Haag, NL
Priority Data:
16181184.926.07.2016EP
Title (EN) METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE
(FR) PROCÉDÉ ET SYSTÈME POUR LIER UNE PUCE À UN SUBSTRAT
Abstract:
(EN) A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.
(FR) L'invention porte sur un procédé et sur un système pour lier thermiquement une puce à un substrat au moyen d'un matériau de liaison thermique disposé entre ceux-ci. Au moins le substrat est préchauffé à partir d'une température initiale à une température élevée inférieure à une température d'endommagement du substrat. Une impulsion lumineuse appliquée à la puce augmente momentanément la température de la puce à une température de crête pulsée inférieure à une température de détérioration de crête de la puce. La température de crête pulsée et augmentée momentanément de la puce provoque un flux de chaleur conduite de la puce au matériau de liaison, le matériau de liaison formant ainsi une liaison.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)