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1. (WO2018021792) POLYHEDRON MODULAR ASSEMBLY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/021792    International Application No.:    PCT/KR2017/007985
Publication Date: 01.02.2018 International Filing Date: 25.07.2017
IPC:
A63H 33/26 (2006.01), A63H 33/04 (2006.01), H01R 33/94 (2006.01), H01R 13/03 (2006.01)
Applicants: PARK, Jin Young [KR/KR]; (KR)
Inventors: PARK, Jin Young; (KR)
Agent: JEONG, Kyu Ho; (KR)
Priority Data:
10-2016-0095464 27.07.2016 KR
Title (EN) POLYHEDRON MODULAR ASSEMBLY
(FR) ENSEMBLE MODULAIRE POLYÉDRIQUE
(KO) 다면체 모듈형 조립체
Abstract: front page image
(EN)The present invention provides a polyhedron modular assembly comprising: at least two unit modules configured as polyhedrons; and at least one connecting medium installed on the unit modules, each connecting medium comprising a magnetic body core and a conductive layer formed on the surface of the magnetic body core as a coating, wherein unit modules adjacent to each other are coupled by magnetic force from the magnetic body core, thereby constituting a combined shape, and a part of the conductive layer is exposed to the surface of each unit module such that an electrical connection is made between different unit modules.
(FR)La présente invention concerne un ensemble modulaire polyédrique comprenant : au moins deux modules unitaires conçus sous forme de polyèdre; et au moins un milieu de connexion placé sur les modules unitaires, chaque milieu de connexion comprenant un noyau de corps magnétique et une couche conductrice formée sur la surface du noyau de corps magnétique comme revêtement, les modules unitaires adjacents l'un à l'autre étant accouplés par force magnétique depuis le noyau de corps magnétique, ce qui permet de constituer une forme combinée, et une partie de la couche conductrice est exposée à la surface de chaque module unitaire de sorte qu'une connexion électrique soit réalisée entre différents modules unitaires.
(KO)본 발명은 다면체로 이루어진 적어도 둘 이상의 단위모듈; 및 상기 단위모듈에 설치되고, 자성체 코어와 상기 자성체 코어의 표면에 코팅된 전도층을 포함하는 적어도 하나 이상의 연결 매개체;를 포함하고, 서로 인접하는 단위모듈들이 상기 자성체 코어의 자력에 의해 결합되어 조합된 형상을 이루고, 상기 단위모듈의 표면에 상기 전도층의 일부가 노출되어 서로 다른 단위모듈 간의 전기적 연결이 이루어지는 것을 특징으로 하는 다면체 모듈형 조립체를 개시한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)