Search International and National Patent Collections

1. (WO2018021473) CIRCUIT BOARD AND SEMICONDUCTOR MODULE

Pub. No.:    WO/2018/021473    International Application No.:    PCT/JP2017/027241
Publication Date: Fri Feb 02 00:59:59 CET 2018 International Filing Date: Fri Jul 28 01:59:59 CEST 2017
IPC: H01L 23/13
H01L 23/36
Applicants: KABUSHIKI KAISHA TOSHIBA
株式会社 東芝
TOSHIBA MATERIALS CO., LTD.
東芝マテリアル株式会社
Inventors: KATO Hiromasa
加藤 寛正
SANO Takashi
佐野 孝
Title: CIRCUIT BOARD AND SEMICONDUCTOR MODULE
Abstract:
A circuit board, provided with: a ceramic substrate having a first surface and a second surface; a first metal part having a first metal plate joined to the first surface and convex parts projecting from the surface of the first metal plate; and a second metal part having a second metal plate joined to the second surface. When the ceramic substrate is equally divided along the long side direction into first through third divided parts, V1, V2, V3, V4, V5, and V6 are numbers satisfying (V4/V1) + (V6/V3) ≤ 2(V5/V2), 0.5 ≤ V4/V1 ≤ 2, 0.5 ≤ V5/V2 ≤ 2, and 0.5 ≤ V6/V3 ≤ 2.