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1. (WO2018021155) DRIP-PROOF STRUCTURE OF ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/021155    International Application No.:    PCT/JP2017/026361
Publication Date: 01.02.2018 International Filing Date: 20.07.2017
IPC:
H01H 9/04 (2006.01), H01H 19/06 (2006.01)
Applicants: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO [JP/JP]; 260, Toyota 3-chome, Ohguchi-cho, Niwa-gun, Aichi 4800195 (JP)
Inventors: AOKI, Hiroshi; (JP).
TSUKAHARA, Yoshiharu; (JP).
KUWABARA, Satoshi; (JP).
HAYASHI, Naoki; (JP)
Agent: HIRATA & PARTNERS; 6th Floor, Niban-cho Cashew Building, 4-3, Niban-cho, Chiyoda-ku, Tokyo 1020084 (JP)
Priority Data:
2016-148630 28.07.2016 JP
2017-130113 03.07.2017 JP
Title (EN) DRIP-PROOF STRUCTURE OF ELECTRONIC COMPONENT
(FR) STRUCTURE ANTI-GOUTTE DE COMPOSANT ÉLECTRONIQUE
(JA) 電子部品の防滴構造
Abstract: front page image
(EN)This drip-proof structure of an electronic component comprises packings 250 (250a - 250d) disposed between a surrounding area of an opening H1 of first and second cases 20, 70 and a surrounding area of an exposure opening 305 of a cover 300. The packings 250 prevent liquid from entering from the exposure opening 305 of the cover 300 and passing between the first and second cases 20, 70 and the cover 300.
(FR)Cette structure anti-goutte d'un composant électronique comprend des emballage 250 (250a - 250d) disposé entre une zone environnante d'une ouverture H1 de premier et second boîtiers 20, 70 et une zone environnante d'une ouverture d'exposition 305 d'un couvercle 300. Les emballages 250 empêchent le liquide de pénétrer à partir de l'ouverture d'exposition 305 du couvercle 300 et de passer entre les premier et second boîtiers 20, 70 et le couvercle 300.
(JA)電子部品の防滴構造は、第1,第2ケース20,70の開口H1の周囲と、カバー300の露出口305の周囲間に配置された、パッキン250(250a~250d)を有する。パッキン250は、カバー300の露出口305から第1,第2ケース20,70とカバー300の間を通して液体が浸入するのを防止する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)