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1. (WO2018019263) DEVICE AND METHOD FOR BONDING ALIGNMENT

Pub. No.:    WO/2018/019263    International Application No.:    PCT/CN2017/094611
Publication Date: Fri Feb 02 00:59:59 CET 2018 International Filing Date: Fri Jul 28 01:59:59 CEST 2017
IPC: H01L 21/68
Applicants: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
上海微电子装备(集团)股份有限公司
Inventors: ZHU, Zhi
朱鸷
ZHAO, Jianjun
赵建军
HUO, Zhijun
霍志军
Title: DEVICE AND METHOD FOR BONDING ALIGNMENT
Abstract:
Provided are a device and method for bonding alignment. The device for bonding alignment comprises a platen assembly and an objective lens (105) located at one side of the platen assembly. The platen assembly comprises a first substrate supporting platform (103) and a rotatable second substrate supporting platform (104). If surfaces of the first and second substrate supporting platforms are not parallel to each other, the second substrate supporting platform is rotated such that the surfaces of the first and second substrate supporting platforms are parallel to each other. Next, a first substrate (301) is loaded to the first substrate supporting platform. Since one side of the platen assembly is provided with the objective lens, an alignment mark (302) on the first substrate can be observed. Next, a second substrate (501) is loaded to the second substrate supporting platform. The objective lens is used to observe an alignment mark (502) on the second substrate. The two substrates are moved according to an observation result obtained by means of the objective lens, such that the alignment marks of the two substrates are aligned, thereby realizing bonding alignment of the two substrates. The method for bonding alignment comprises, substrate supporting platforms are adjusted first, and then substrates are aligned. The invention does not need a very high precision device, thereby reducing complexity of a device. Moreover, adjusting substrate supporting platforms first ensures global precision control with respect to alignment of substrates, and can in particular reduce wedge error resulting from bonding of deformed substrates.