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1. (WO2018018915) PCB BOARD, MANUFACTURING METHOD FOR THE PCB BOARD AND MOBILE TERMINAL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/018915    International Application No.:    PCT/CN2017/078874
Publication Date: 01.02.2018 International Filing Date: 30.03.2017
IPC:
H05K 1/02 (2006.01), H05K 3/00 (2006.01)
Applicants: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. [CN/CN]; No. 18, Haibin Road, Wusha, Chang'an Dongguan, Guangdong 523860 (CN)
Inventors: CHEN, Xinfeng; (CN)
Agent: TSINGYIHUA INTELLECTUAL PROPERTY LLC; Room 301 Trade Building, Zhaolanyuan, Tsinghua University, Qinghuayuan, Haidian District Beijing 100084 (CN)
Priority Data:
201610608626.X 28.07.2016 CN
Title (EN) PCB BOARD, MANUFACTURING METHOD FOR THE PCB BOARD AND MOBILE TERMINAL
(FR) PCB, SON PROCÉDÉ DE FABRICATION ET TERMINAL MOBILE
(ZH) PCB板、PCB板的制造方法及移动终端
Abstract: front page image
(EN)Disclosed are a PCB board (100), a manufacturing method for the PCB board (100) and a mobile terminal. The PCB board (100) comprises: a board body (1); and a detection wiring (2), wherein the detection wiring (2) is arranged on the board body (1), and the detection wiring (2) is provided with a copper exposure portion, with a heat dissipation layer (3) being laid on the copper exposure portion.
(FR)L'invention concerne une carte de circuit imprimé (PCB) (100), son procédé de fabrication (100) et un terminal mobile. La PCB (100) est pourvue : d'un corps de carte (1) ; et d'un câblage de détection (2) disposé sur le corps de carte (1) et qui comporte une partie d'exposition de cuivre, une couche de dissipation thermique (3) étant déposée sur la partie d'exposition de cuivre.
(ZH)一种PCB板(100)、PCB板(100)的制造方法及移动终端。PCB板(100)包括板体(1);检测走线(2),该检测走线(2)设在板体(1)上,该检测走线(2)上具有露铜部,该露铜部上铺设有散热层(3)。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)