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1. (WO2018018448) METHOD AND SYSTEM FOR LOWERING TEMPERATURE OF CHIP
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/018448    International Application No.:    PCT/CN2016/091846
Publication Date: 01.02.2018 International Filing Date: 27.07.2016
IPC:
G06F 11/30 (2006.01), G06F 9/50 (2006.01)
Applicants: LI, Yuanyuan [CN/CN]; (CN)
Inventors: LI, Yuanyuan; (CN)
Agent: SHENZHEN KEGUAN INTELLECTUAL PROPERTY AGENCY CO., LTD; Room 303 Building 5 Donghuayuan Nanhai Road, Nanshan District Shenzhen, Guangdong 518000 (CN)
Priority Data:
Title (EN) METHOD AND SYSTEM FOR LOWERING TEMPERATURE OF CHIP
(FR) PROCÉDÉ ET SYSTÈME POUR ABAISSER LA TEMPÉRATURE D'UNE PUCE
(ZH) 芯片中温度降低方法及系统
Abstract: front page image
(EN)A method and a system for lowering the temperature of a chip, the method comprising the following steps: detecting the temperature of each kernel and running threads (S101); determining whether the temperature of the kernel exceeds a temperature threshold (S102); if the temperature of the kernel exceeds the temperature threshold, reducing the number of threads of the kernel (S103). The technical solution has the advantage of effectively lowering temperature.
(FR)L'invention concerne un procédé et un système pour abaisser la température d'une puce. Le procédé consiste: à détecter la température de chaque noyau et de fils d'exécution (S101); à déterminer si la température du noyau dépasse un seuil de température (S102); si la température du noyau dépasse le seuil de température, à réduire le nombre de fils du noyau (S103). La solution technique de l'invention présente l'avantage d'abaisser efficacement la température.
(ZH)一种芯片中温度降低方法及系统,所述方法包括如下步骤:检测每个内核的温度以及运行的线程(S101);判断该内核的温度是否超过温度阈值(S102);如该内核的温度超过温度阈值,则减少该内核的线程数量(S103)。该技术方案具有有效降低温度的优点。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)