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1. (WO2018017379) APPARATUS AND METHOD OF CONTACT ELECTROPLATING OF ISOLATED STRUCTURES

Pub. No.:    WO/2018/017379    International Application No.:    PCT/US2017/041817
Publication Date: Fri Jan 26 00:59:59 CET 2018 International Filing Date: Fri Jul 14 01:59:59 CEST 2017
IPC: C25D 17/00
C25D 17/12
C25D 5/06
C25D 5/08
C25D 5/20
C25D 7/12
H05K 3/24
Applicants: ECSI FIBROTOOLS, INC.
Inventors: KADIJA, Igor, V.
Title: APPARATUS AND METHOD OF CONTACT ELECTROPLATING OF ISOLATED STRUCTURES
Abstract:
The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.