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1. (WO2018016957) DECAPSULATION OF ELECTRONIC DEVICES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/016957    International Application No.:    PCT/NL2017/050491
Publication Date: 25.01.2018 International Filing Date: 20.07.2017
IPC:
H01L 21/56 (2006.01), H01L 21/67 (2006.01), H05K 3/28 (2006.01), H01L 21/311 (2006.01)
Applicants: JIACO INSTRUMENTS HOLDING B.V. [NL/NL]; Van Embdenstraat 86 2628 ZG Delft (NL)
Inventors: TANG, Jiaqi; (NL).
BEENAKKER, Cornelis Ignatius Maria; (NL).
VAN DEN HOEK, Willibrordus Gerardus Maria; (NL)
Agent: JANSEN, C.M.; Carnegieplein 5 2517 KJ Den Haag (NL)
Priority Data:
2017198 20.07.2016 NL
Title (EN) DECAPSULATION OF ELECTRONIC DEVICES
(FR) DÉCAPSULATION DE DISPOSITIFS ÉLECTRONIQUES
Abstract: front page image
(EN)The invention is directed to a method for treating an electronic device that is encapsulated in a plastic package, said method comprising the steps of providing a gas stream comprising a hydrogen source; inducing a hydrogen- containing plasma stream from said gas; and directing the hydrogen- containing plasma stream to the plastic package to etch the plastic package.
(FR)L'invention concerne un procédé de traitement d'un dispositif électronique qui est encapsulé dans un emballage en plastique, ledit procédé comprenant les étapes consistant à fournir un courant gazeux comprenant une source d'hydrogène; à induire un courant de plasma contenant de l'hydrogène à partir dudit gaz; et à diriger le courant de plasma contenant de l'hydrogène vers l'emballage en plastique afin de graver l'emballage en plastique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)