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1. (WO2018016824) MATERIAL MOLDING DEVICE

Pub. No.:    WO/2018/016824    International Application No.:    PCT/KR2017/007659
Publication Date: Fri Jan 26 00:59:59 CET 2018 International Filing Date: Tue Jul 18 01:59:59 CEST 2017
IPC: C03B 23/03
C03B 23/00
Applicants: LG ELECTRONICS INC.
엘지전자 주식회사
Inventors: CHO, Chang Min
조창민
LEE, Dongil
이동일
YOO, Han Jong
유한종
LEE, Jin Hyuk
이진혁
MINN, Changshik
민창식
Title: MATERIAL MOLDING DEVICE
Abstract:
A material molding device includes: a first mold including a first molding unit pressing a first material and a second molding unit disposed below the first molding unit and having an opening exposing the first material and a portion engaged with the first molding unit to mold at least a portion of the first material; a second mold disposed below the first mold to support a second material; and a linking mold including a fixing unit disposed between the first mold and the second mold to press and fix the second material disposed on the second mold, and a linking unit coupled to the fixing unit in a vertically movable manner to press and mold the second material by being linked with the mold of the first material.