Search International and National Patent Collections
|1. (WO2018016824) MATERIAL MOLDING DEVICE|
|Applicants:||LG ELECTRONICS INC.
|Inventors:||CHO, Chang Min
YOO, Han Jong
LEE, Jin Hyuk
|Title:||MATERIAL MOLDING DEVICE|
A material molding device includes: a first mold including a first molding unit pressing a first material and a second molding unit disposed below the first molding unit and having an opening exposing the first material and a portion engaged with the first molding unit to mold at least a portion of the first material; a second mold disposed below the first mold to support a second material; and a linking mold including a fixing unit disposed between the first mold and the second mold to press and fix the second material disposed on the second mold, and a linking unit coupled to the fixing unit in a vertically movable manner to press and mold the second material by being linked with the mold of the first material.