Search International and National Patent Collections

1. (WO2018016723) SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Pub. No.:    WO/2018/016723    International Application No.:    PCT/KR2017/004854
Publication Date: Fri Jan 26 00:59:59 CET 2018 International Filing Date: Fri May 12 01:59:59 CEST 2017
IPC: H01L 23/00
H01L 23/488
Applicants: LBSEMICON CO., LTD
엘비세미콘 주식회사
Inventors: KWON, Jae Jin
권재진
Title: SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Abstract:
The present invention relates to a method for manufacturing a semiconductor package, comprising: a first step of forming a primary solder ball on a UBM structure; and a second step of forming a secondary solder ball on a top surface of the UBM structure by performing a reflow process with respect to the primary solder ball while the side walls of the UBM structure are exposed.