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1. (WO2018016614) COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/016614    International Application No.:    PCT/JP2017/026412
Publication Date: 25.01.2018 International Filing Date: 21.07.2017
IPC:
C07C 43/215 (2006.01), C07C 69/54 (2006.01), C07D 311/80 (2006.01), C07D 311/90 (2006.01), C08F 216/10 (2006.01), C08F 224/00 (2006.01), G03F 7/031 (2006.01), G03F 7/11 (2006.01), G03F 7/20 (2006.01), G03F 7/26 (2006.01)
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC. [JP/JP]; 5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008324 (JP)
Inventors: ECHIGO, Masatoshi; (JP)
Agent: INABA, Yoshiyuki; (JP).
ONUKI, Toshifumi; (JP).
NAITO, Kazuhiko; (JP)
Priority Data:
2016-143659 21.07.2016 JP
Title (EN) COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD
(FR) COMPOSÉ, RÉSINE, COMPOSITION ET PROCÉDÉ DE FORMATION DE MOTIF
(JA) 化合物、樹脂、組成物及びパターン形成方法
Abstract: front page image
(EN)This compound is represented by formula (0).
(FR)Ce composé est représenté par la formule (0).
(JA)下記式(0)で表される、化合物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)