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1. (WO2018016306) RESIN COMPOSITION AND FILM FORMED OF SAID RESIN COMPOSITION

Pub. No.:    WO/2018/016306    International Application No.:    PCT/JP2017/024299
Publication Date: Fri Jan 26 00:59:59 CET 2018 International Filing Date: Tue Jul 04 01:59:59 CEST 2017
IPC: C08L 33/06
C08J 5/18
C08L 51/04
Applicants: DENKA COMPANY LIMITED
デンカ株式会社
Inventors: MATSUMOTO, Masanori
松本 真典
NOGUCHI, Tetsuo
野口 哲央
Title: RESIN COMPOSITION AND FILM FORMED OF SAID RESIN COMPOSITION
Abstract:
Provided are: a resin composition which is not susceptible to the occurrence of birefringence, while having excellent heat resistance, film strength and thermal stability; and a film which is formed of this resin composition. The present invention provides a resin composition which is composed of 17-31% by mass of an aromatic vinyl monomer unit (A), 38-63% by mass of a (meth)acrylic acid ester monomer unit (B), 4-14% by mass of an unsaturated dicarboxylic acid anhydride monomer unit (C) and 4-25% by mass of a conjugated diene monomer unit (D), and wherein the absolute value of formula 1 is 0.005 or less. In formula 1, [A], [B], [C] and [D] respectively represent the mass ratios of the aromatic vinyl monomer unit (A), the (meth)acrylic acid ester monomer unit (B), the unsaturated dicarboxylic acid anhydride monomer unit (C) and the conjugated diene monomer unit (D) in the resin composition; and [A] + [B] + [C] + [D] = 1. Formula 1 -0.10 × [A] - 0.004 × [B] + 0.10 × [C] + 0.09 × [D]