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1. (WO2018016138) POLYAMIDE PARTICLES, PRODUCTION PROCESS THEREFOR, RESIN COMPOSITION, AND MOLDED ARTICLE
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Pub. No.: WO/2018/016138 International Application No.: PCT/JP2017/014636
Publication Date: 25.01.2018 International Filing Date: 10.04.2017
IPC:
C08J 3/12 (2006.01) ,C08K 7/04 (2006.01) ,C08K 7/14 (2006.01) ,C08L 63/00 (2006.01) ,C08L 77/00 (2006.01) ,C08L 101/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3
Processes of treating or compounding macromolecular substances
12
Powdering or granulating
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
14
Glass
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77
Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
Applicants:
ダイセル・エボニック株式会社 DAICEL-EVONIK LTD. [JP/JP]; 東京都新宿区西新宿二丁目3番1号 2-3-1, Nishi-shinjuku, Shinjuku-ku, Tokyo 1630913, JP
Inventors:
六田 充輝 MUTSUDA Mitsuteru; JP
中家 芳樹 NAKAIE Yoshiki; JP
宇野 孝之 UNO Takayuki; JP
Agent:
鍬田 充生 KUWATA Mitsuo; JP
阪中 浩 SAKANAKA Hiroshi; JP
Priority Data:
2016-14182519.07.2016JP
Title (EN) POLYAMIDE PARTICLES, PRODUCTION PROCESS THEREFOR, RESIN COMPOSITION, AND MOLDED ARTICLE
(FR) PARTICULES DE POLYAMIDE AINSI QUE PROCÉDÉ DE PRODUCTION DE CELLES-CI, COMPOSITION DE RÉSINE, ET ARTICLE MOULÉ
(JA) ポリアミド粒子及びその製造方法、樹脂組成物並びに成形品
Abstract:
(EN) Polyamide particles which comprise a polyamide and have a water absorption of 0.5-2.5 wt% are prepared. Due to this, a curable resin can give a cured object having improved toughness. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of about 100-150ºC. The polyamide may have an alicyclic structure. The polyamide particles of the present invention have an average particle diameter of about 5-40 µm and a specific surface area, as determined by the BET method, of about 0.08-12 m2/g. The polyamide particles of the present invention may be spherical and have an average particle diameter of about 15-25 µm. The polyamide particles of the present invention, when being heated in analysis by differential scanning calorimetry (DSC) at a heating rate of 10 ºC/min, may have an exothermic peak in the temperature range between the glass transition temperature and melting point of the polyamide.
(FR) Selon l’invention, des particules de polyamide contenant un polyamide et de coefficient d’absorption d’eau compris entre 0,5 et 2,5% en masse sont préparées, permettant ainsi d’améliorer la solidité d’un produit durci d’une résine durcissable. Ledit polyamide peut être un polyamide semi-cristallin, présente une température de transition vitreuse comprise environ entre 100 et 150°C, et peut posséder une structure alicyclique. Le diamètre moyen particulaire des particules de polyamide de l’invention est compris environ entre 5 et 40μm, et leur surface spécifique selon un procédé BET est comprise environ entre 0,08 et 12m/g. En outre, ces particules de polyamide sont de forme sphérique, et peuvent présenter un diamètre particulaire moyen compris environ entre 15 et 25μm. Enfin, ces particules de polyamide peuvent présenter un pic de génération de chaleur dans une plage de températures entre la température de transition vitreuse dudit polyamide et son point de fusion, lors d’une élévation de température à une vitesse de 10°C/minute selon une analyse calorimétrique différentielle (ACD).
(JA) ポリアミドを含み、かつ吸水率が0.5~2.5重量%であるポリアミド粒子を調製することにより、硬化性樹脂の硬化物の靱性を向上できる。前記ポリアミドは半結晶性ポリアミドであってもよい。前記ポリアミドのガラス転移温度は100~150℃程度である。前記ポリアミドは脂環式構造を有していてもよい。本発明のポリアミド粒子の平均粒径は5~40μm程度であり、BET法による比表面積が0.08~12m/g程度である。また、本発明のポリアミド粒子は、球状であり、かつ平均粒径が15~25μm程度であってもよい。さらに、本発明のポリアミド粒子は、示差走査熱量測定(DSC)によって10℃/分の速度で昇温したとき、前記ポリアミドのガラス転移温度と融点との間の温度範囲に発熱ピークを有していてもよい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)