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1. (WO2018014568) NEW PROCESS FOR COPPER POLISHING PROCESSING OF SAPPHIRE WAFER
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/014568 International Application No.: PCT/CN2017/076570
Publication Date: 25.01.2018 International Filing Date: 14.03.2017
IPC:
B24B 19/22 (2006.01) ,B24B 39/00 (2006.01) ,B24B 57/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
19
Single purpose machines or devices for particular grinding operations not covered by any other main group
22
characterised by a special design with respect to properties of the material of non-metallic articles to be ground
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
39
Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02
for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Applicants: EGING PHOTOVOLTAIC TECHNOLOGY CO., LTD[CN/CN]; 18’ Jinwu Road, Jintan Changzhou, Jiangsu 213213, CN
Inventors: ZHAO, Nengwei; CN
Agent: CHANGZHOU INNOVATION PATENT AGENCY FIRM(GENERAL PARTNER); F4,Building 2 NO.151 Middle Renmin Road, Wujin Changzhou, Jiangsu 213161, CN
Priority Data:
201610570690.319.07.2016CN
Title (EN) NEW PROCESS FOR COPPER POLISHING PROCESSING OF SAPPHIRE WAFER
(FR) NOUVEAU PROCÉDÉ DE TRAITEMENT DE POLISSAGE AU CUIVRE D'UNE GALETTE EN SAPHIR
(ZH) 一种用于蓝宝石晶片铜抛加工的新工艺
Abstract:
(EN) Provided is a new process for the copper polishing processing of a sapphire wafer, belonging to the field of LED substrate processing. Scratches caused in the previous procedure are removed gradually by selecting three different polishing solutions with hardnesses from high to low, fixing the injection order of the polishing solutions and controlling the injection times of the polishing solutions, so that a relatively small damaged layer is formed on the surface of a final product, thus achieving the purpose of reducing the scratches the surface of the sapphire. The process is simple to operate and has an obvious effect.
(FR) L'invention concerne un nouveau procédé de traitement de polissage au cuivre d'une tranche en saphir, faisant partie du domaine du traitement des substrats de LED. Les rayures provoquées dans la procédure précédente sont éliminées progressivement en choisissant trois solutions de polissage différentes ayant des duretés allant d'élevée à faible, en fixant l'ordre d'injection des solutions de polissage et en commandant les temps d'injection des solutions de polissage, de sorte qu'une couche endommagée relativement petite est formée sur la surface d'un produit final, ce qui permet de réaliser l'objectif de réduction des rayures sur la surface du saphir. Le procédé est simple à mettre en œuvre et a un effet évident.
(ZH) 一种蓝宝石晶片铜抛加工的新工艺,属于LED衬底加工领域。通过选择硬度由高到低三种不同的抛光液,并固定抛光液的喷射顺序,控制抛光液的喷射时间,逐步去除前一道工序造成的划痕,使得最终产品表面形成较小的损伤层,来达到减小蓝宝石表面划痕的目的,该工艺操作方法简单,效果明显。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)